<p>To elucidate the mechanisms of cellular mechanotransduction, it is necessary to employ biomaterials that effectively merge biofunctionality with appropriate mechanical characteristics. Agarose is a standard biopolymer used in cartilage mechanobiology but lacks necessary adhesion motifs for cell-matrix interactions to complete mechanostransduction studies. Collagen type I is a natural biomaterial used in cartilage mechanotransduction studies but creates an environment much softer than native cartilage tissue.  In these studies, agarose was blended at two final concentrations (2% w/v and 4% w/v) with collagen type I (2 mg/mL). The overarching goal was to determine whether a composite hydrogel of agarose and collagen can create a mechanically and biologically suitable matrix for chondrocyte studies. First, hydrogels were characterized by rheologic and compressive properties, contraction, and structural homogeneity. Following baseline characterization, primary murine chondrocytes were embedded (1 × 106 cells/mL) within the hydrogels to assess the longer-term <em>in vitro</em> impact on matrix mechanics, cell proliferation, sulfated glycosaminoglycan (sGAG) content, and cellular morphology. To begin probing questions about physiologic loading conditions that chondrocytes experience <em>in</em> <em>vivo</em>, a custom compression loading system was validated using cell-laden hydrogels. Briefly, the 4% agarose – 2 mg/mL collagen I hydrogel composites were able to retain chondrocyte morphology over 21 days in culture, resulted in continual sGAG production, and had bulk mechanics similar to that of the stiffest hydrogel material tested, indicating this hydrogel class may be promising towards developing an effective hydrogel for chondrocyte mechanotransduction and mechanobiology studies, a critical step towards a fuller understanding of cell-matrix interactions. </p>

This thesis presents research on the force and deflection behavior of beams with rectangular cross-sections undergoing lateral torsional buckling. The large 3-D deflection path of buckling beam tips was closely approximated by circular arcs in two planes. A new chain algorithm element was created from pseudo-rigid-body segments and used in a chain calculation that accurately predicted the force deflection relationship of beams with large 3-D deflections.

Models (both physical and numerical) of the friction stir (FS) welding process are used to develop a greater understanding of the influence of independent process parameters on dependent process output variables, such as torque, power, specific weld energy, peak temperature, cooling rates and various metallurgical factors (e.g., grain size and precipitates). An understanding of how the independent process parameters influence output variables and ultimately their effect on resultant properties (e.g., strength, hardness, etc..) is desirable. Most models developed have been validated primarily for aluminum alloys with relatively small amounts of experimental data. Fewer models have been validated for steels or stainless steels, particularly since steels and stainless steels have proven more challenging to friction stir than aluminum alloys. The Gleeble system is also a powerful tool with the capability to perform thermomechanical simulations in a known and controlled environment and provide physical representation of resultant microstructure and hardness values. The coupling of experimental data and physical simulated data can be extremely useful in assessing the capabilities of friction stir numerical process models. The overall approach is to evaluate Isaiah an existing three-dimensional finite element code developed at Cornell University by comparing against experimental and physically-simulated data to determine how well the code output relates to real FS data over a range of nine processing conditions. Physical simulations replicating select thermomechanical streamline histories were conducted to provide a physical representation of resultant metallurgy and hardness. Isaiah shows promise in predicting qualitative trends over a limited range of parameters and is not recommended for use as a predictive tool but rather a complimentary tool, Once properly calibrated, the Isaiah code can be a powerful tool to gain insight into the process, strength evolution during the process and coupled with a texture evolution model may also provide insight into microstructural and texture evolution over a range for which it is calibrated.

Asthma is the leading chronic illness in children in the United States. Since children in the U.S. spend a majority of their time indoors there is an increased need to understand key sources of daily asthma triggers in the home. Bacterial endotoxin, dust mite allergens and β-D-glucan have been shown to be potent inducers of asthma attacks, and high levels of these allergens in homes can trigger attacks in those with asthma. We aim to better understand the risks to those with asthma that might be associated with evaporative cooler (EC) use in low-income homes. ECs are often promoted because of their low energy consumption and decreased environmental impact compared to central air conditioning (AC). Because of their lower cost, ECs are more widely used in low-income homes. ECs use evaporation to cool the air, which leads to higher indoor relative humidity. This may create an ecological niche for house dust mites in semi-arid climates where they are normally absent. EC sump water also provides an ideal environment for bacteria and fungi to grow, possibly resulting in EC loading the air with more potential asthma triggers than central air conditioning. We sampled low-income homes around Utah county with central air and evaporative cooling and tested them for the presence of dust mite allergens, β-D-glucan and endotoxin. There were significantly higher levels of endotoxins and β-(1→3)-D-glucans in the EC homes compared to the AC homes, with increased odds of dust mite allergen prevalence but not at clinically significant levels. These findings suggest that in semi-arid environments, endotoxin and β-(1→3)-D-glucan levels in homes with evaporative coolers are more elevated than dust mite allergens.

In today´s interconnected world, our lives are inextricably linked with technology, a trend set to continue. Robots, pivotal to global industry and commerce, have made an significant impact since their inception. This report proposes an approach to enhance robotic functionality by integrating a 3D camera into a gripper´s case. This integration improves robotic functions and refines how robots perform tasks, mirroring human-like capabilities. This paper outlines the design and creation process of the prototype, including considerations for its development. Extensive research was conducted on current grippers, 3D vision systems, and available 3D cameras. Moreover, the design process using CAD tools is shown and explained in detail, followed by the creation of a physical prototype through 3D printing. The study underscores the significance of such advancements in shaping the future of robotics. It emphasizes that the innovative design of these products will play a crucial role in advancing automation technology.

<p> </p> <p>Modern remote sensing platforms such as unmanned aerial vehicles (UAVs) that can carry a variety of sensors including RGB frame cameras, hyperspectral (HS) line cameras, and LiDAR sensors are commonly used in several application domains. In order to derive accurate products such as point clouds and orthophotos, sensors’ interior and exterior orientation parameters (IOP and EOP) must be established. These parameters are derived/refined in a triangulation framework through minimizing the discrepancy between conjugate features extracted from involved datasets. Existing triangulation approaches are not general enough to deal with varying nature of data from different sensors/platforms acquired in diverse environmental conditions. This research develops a generic triangulation framework that can handle different types of primitives (e.g., point, linear, and/or planar features), and sensing modalities (e.g., RGB cameras, HS cameras, and/or LiDAR sensors) for delivering accurate products under challenging conditions with a primary focus on digital agriculture and stockpile monitoring application domains. </p>

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The work reported in this dissertation is intended to propose, analyze and demonstrate a technology for a high temperature integrated power electronics module, for high temperature (e.g those over 200oC) applications involving high density and low stress. To achieve this goal, this study has examined some existing packaging approaches, such as wire-bond interconnects and solder die-attach, flip-chip and pressure contacts. Based on the survey, a high temperature, multilayer 3-D packaging technology in the form of an Embedded Chip Module (ECM) is proposed to realize a lower stress distribution in a mechanically balanced structure with double-sided metallization layers and material CTE match in the structure. Thermal and thermo-mechanical analysis on an ECM is then used to demonstrate the benefits on the cooling system, and to study the material and structure for reducing the thermally induced mechanical stress. In the thermal analysis, the high temperature ECM shows the ability to handle a power density up to 284 W/in3 with a heat spreader only 2.1x2.1x0.2cm under forced convection. The study proves that the cooling system can be reduced by 76% by using a high temperature module in a room temperature environment. Furthermore, six proposed structures are compared using thermo-mechanical analysis, in order to obtain an optimal structure with a uniform low stress distribution. Since pure Mo cannot be electroplated, the low CTE metal Cr is proposed as the stress buffering material to be used in the flat metallization layers for a fully symmetrical ECM structure. Therefore, a chip area stress as low as 126MPa is attained. In the fabrication process, the high temperature material glass and a ceramic adhesive are applied as the insulating and sealing layers. Particularly, the Cr stress buffering layer is successfully electroplated in the high temperature ECM by means of the hard chrome plating process. The flat metallization layer is accomplished by using a combined structure with Cr and Cu metallization layers. The experimental evaluations, including the electrical and thermal characteristics of the ECM, have been part of in the study. The forward and reverse characteristics of the ECM are presented up to 250oC, indicating proper device functionality. The study on the reverse characteristics of the ECM indicates that the large leakage current at high temperature is not due to the package surrounding the chip, but chiefly caused by the Schottky junction and the chip passivation layer. Finally, steady-state and transient measurements are conducted in terms of the thermal measurements. The steady-state thermal measurement is used to demonstrate the cooling system reduction. To obtain the thermal parameters of the different layers in the high temperature ECM, the transient thermal measurement is applied to a single chip ECM based on the temperature cooling-down curve measurement. / Ph. D.