As CMOS technologies move to sub-100nm regions, the design and verification for analog/mixed-signal circuits become more and more difficult due to the problems including the decrease of transconductance, severe gate leakage and profound mismatches. The increasing manufacturing-induced process variations and their impacts on circuit performances make the already complex circuit design even more sophisticated in the deeply scaled CMOS technologies. Given these barriers, efforts are needed to ensure the circuits are robust and optimized with consideration of parametric variations. This research presents innovative computer-aided design approaches to address three such problems: (1) large analog/mixed-signal performance modeling under process variations, (2) yield-aware optimization for complex analog/mixedsignal systems and (3) on-chip test scheme development to detect and compensate parametric failures. The first problem focus on the efficient circuit performance evaluation with consideration of process variations which serves as the baseline for robust analog circuit design. We propose statistical performance modeling methods for two popular types of complex analog/mixed-signal circuits including Sigma-Delta ADCs and charge-pump PLLs. A more general performance modeling is achieved by employing a geostatistics motivated performance model (Kriging model), which is accurate and efficient for capturing stand-alone analog circuit block performances. Based on the generated block-level performance models, we can solve the more challenging problem of yield-aware system optimization for large analog/mixed-signal systems. Multi-yield pareto fronts are utilized in the hierarchical optimization framework so that the statistical optimal solutions can be achieved efficiently for the systems. We further look into on-chip design-for-test (DFT) circuits in analog systems and solve the problems of linearity test in ADCs and DFT scheme optimization in charge-pump PLLs. Finally a design example of digital intensive PLL is presented to illustrate the practical applications of the modeling, optimization and testing approaches for large analog/mixed-signal systems.

The verification of analog designs has been a challenging task for a few years now. Several approaches have been taken to tackle the main problem related to the complexity that such task presents to design and verification teams. The methodology presented in this document is based on the experiences and research work carried out by the Concordia University's Hardware Verification and the U. of Texas' IC systems design groups. The representation of complex systems where different interactions either mechanical or electrical take place requires an intricate set of mathematical descriptions which greatly vary according to the system under test. As a simple and very relevant example one can look at the integration of RF-MEMS as active elements in System-On-Chip architectures. In order to tackle such heterogeneous interaction for a consistent model, the use of stochastic hybrid models is described and implemented for very simple examples using high level modeling tools for a succinct and precise description. / text

The miniaturization and digitization of modern microelectronic systems have made Analog-to-Digital converters (ADC) key building components in many applications. Internet and entertainment technologies demand higher and higher performance from the hardware components in many communication and multimedia systems, but at the same time increased mobility demands less and less power consumption. Many applications, such as instrumentation, video, radar and communications, require very high accuracy and speed and with resolutions up to 16 bits and sampling rates in the 100s of MHz, pipelined ADCs are very suitable for such purposes. Resolutions above 10 bits often require very high power consumption and silicon area if no error correction technique is employed. Calibration relaxes the accuracy requirement of the individual building blocks of the ADC and enables power and area savings. Digital calibration is preferred over analog calibration due to higher robustness and accuracy. Furthermore, the microprocessors that process the digital information from the ADCs have constantly reduced cost and power consumption and improved performance due to technology scaling and innovative microprocessor architectures. The work in this dissertation presents a novel digital background calibration technique for high-speed, high-resolution pipelined ADCs. The technique is implemented in a 14 bit, 100 MS/s pipelined ADC fabricated in Taiwan Semiconductor Manufacturing Company (TSMC) 0.13µm Complementary Metal Oxide Semiconductor (CMOS) digital technology. The prototype ADC achieves better than 11.5 bits linearity at 100 MS/s and achieves a best-in-class figure of merit of 360 fJ/conversion-step. The core ADC has a power consumption of 105 mW and occupies an active area of 1.25 mm^2. The work in this dissertation also presents a low-power, 8-bit algorithmic ADC. This ADC reduces power consumption at system level by minimizing voltage reference generation and ADC input capacitance. This ADC is implemented in International Business Machines Corporation (IBM) 90nm digital CMOS technology and achieves around 7.5 bits linearity at 0.25 MS/s with a power consumption of 300 µW and an active area of 0.27 mm^2.

Variations in ionospheric plasma density can cause large amplitude and phase changes in the radio waves passing through this region. Ionospheric weather can have detrimental effects on several communication systems, including radars, navigation systems such as the Global Positioning Sytem (GPS), and high-frequency communications. As a result, creating models of the ionospheric density is of paramount interest to scientists working in the field of satellite communication. Numerous empirical and theoretical models have been developed to study the upper atmosphere climatology and weather. Multiple measurements of plasma density over a region are of marked importance while creating these models. The lack of spatially distributed observations in the upper atmosphere is currently a major limitation in space weather research. A constellation of CubeSat platforms would be ideal to take such distributed measurements. The use of miniaturized instruments that can be accommodated on small satellites, such as CubeSats, would be key to acheiving these science goals for space weather. The accepted instrumentation techniques for measuring the electron density are the Langmuir probes and the Plasma Impedance Probe (PIP). While Langmuir probes are able to provide higher resolution measurements of relative electron density, the Plasma Impedance Probes provide absolute electron density measurements irrespective of spacecraft charging. The central goal of this dissertation is to develop an integrated architecture for the PIP that will enable space weather research from CubeSat platforms. The proposed PIP chip integrates all of the major analog and mixed-signal components needed to perform swept-frequency impedance measurements. The design's primary innovation is the integration of matched Analog-to-Digital Converters (ADC) on a single chip for sampling the probes current and voltage signals. A Fast Fourier Transform (FFT) is performed by an off-chip Field-Programmable Gate Array (FPGA) to compute the probes impedance. This provides a robust solution for determining the plasma impedance accurately. The major analog errors and parametric variations affecting the PIP instrument and its effect on the accuracy and precision of the impedance measurement are also studied. The system clock is optimized in order to have a high performance ADC. In this research, an alternative clock generation scheme using C-elements is described to reduce the timing jitter and reference spurs in phase locked loops. While the jitter performance and reference spur reduction is comparable with prior state-of-the-art work, the proposed Phase Locked Loop (PLL) consumes less power with smaller area than previous designs.

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L'expansion du marché des semi-conducteurs dans tous les secteurs d'activité résulte de la capacité de créer de nouvelles applications grâce à l'intégration de plus en plus de fonctionnalités sur une surface de plus en plus faible. Pour chaque entreprise, la compétitivité dépend du coût de fabrication mais aussi de la fiabilité du produit. Ainsi, la phase de test d'un circuit intégré, et plus particulièrement des circuits analogiques et mixtes, est le facteur prédominant dans les choix d'un compromis entre ces deux critères antagonistes, car son coût est désormais proche du coût de production. Cette tendance contraint les acteurs du marché à mettre en place de nouvelles solutions moins onéreuses. Parmi les recherches dans ce domaine, la conception en vue du test (DfT) consiste à intégrer pendant le développement de la puce, une circuiterie additionnelle susceptible d'en faciliter le test, voire d'effectuer un auto-test (BIST). Mais la sélection d'une de ces techniques nécessite une évaluation de leur capacité de différencier les circuits fonctionnels des circuits défaillants. Ces travaux de recherche introduisent une méthodologie d'estimation de la qualité d'une DfT ou d'un BIST dans le flot de conception de circuits analogiques et mixtes. Basée sur la génération d'un large échantillon prenant en compte l'impact des variations d'un procédé technologique sur les performances et les mesures de test du circuit, cette méthodologie calcule les métriques de test exprimant la capacité de chaque technique de détecter les circuits défaillants sans rejeter des circuits fonctionnels et d'accepter les circuits fonctionnels en rejetant les circuits défaillant. Ensuite, le fonctionnement d'un auto-test numérique adapté aux convertisseurs sigma-delta est présenté ainsi qu'une nouvelle méthode de génération et d'injection du stimulus de test. La qualité de ces techniques d'auto-test est démontrée en utilisant la méthodologie d'estimation des métriques de test. Enfin, un démonstrateur développé sur un circuit programmable démontre la possibilité d'employer une technique d'auto-test dans un système de calibrage intégré. / The pervasiveness of the semiconductor industry in an increasing range of applications that span human activity stems from our ability to integrate more and more functionalities onto a small silicon area. The competitiveness in this industry, apart from product originality, is mainly defined by the manufacturing cost, as well as the product reliability. Therefore, finding a trade-off between these two often contradictory objectives is a major concern and calls for efficient test solutions. The focus nowadays is mainly on Analog and Mixed-Signal (AMS) circuits since the associated testing cost can amount up to 70% of the overall manufacturing cost despite that AMS circuits typically occupy no more than 20% of the die area. To this end, there are intensified efforts by the industry to develop more economical test solutions without sacrificing product quality. Design-for-Test (DfT) is a promising alternative to the standard test techniques. It consists of integrating during the development phase of the chip extra on-chip circuitry aiming to facilitate testing or even enable a built-in self-test (BIST). However, the adoption of a DFT technique requires a prior evaluation of its capability to distinguish the functional circuits from the defective ones. In this thesis, we present a novel methodology for estimating the quality of a DfT technique that is readily incorporated in the design flow of AMS circuits. Based on the generation of a large synthetic sample of circuits that takes into account the impact of the process ariations on the performances and test measurements, this methodology computes test metrics that determine whether the DFT technique is capable of rejecting defective devices while passing functional devices. In addition, the thesis proposes a novel, purely digital BIST technique for Sigma-Delta analog-to-digital converters. The efficiency of the test metrics evaluation methodology is demonstrated on this novel BIST technique. Finally, a hardware prototype developed on an FPGA shows the possibility of adapting the BIST technique within a calibration system.

The rapid development in the semiconductors industry has enabled the placement of multiple chips on a single die. This has helped boost the functionality of modernday application specific integrated circuits (ASICs). Thus, digital circuits are being increasingly placed along-side analog and RF circuits in what are known as mixed signal circuits. As a result, the noise couplings through the substrate now have an increased role in mixed-signal ASIC design. Therefore, there is a need to study the effects of substrate noise and include them in the traditional design methodology. ∆Σ analog-to-digital converters (ADCs) are a perfect example of digital integration in traditionally analog circuits. ADCs, used to interface digital circuits to an analog world, are indispensable in mixed-signal systems and therefore set an interesting case study. A ∆Σ ADC is used in this thesis to study the effects of substrate noise. A background study is presented in the thesis to better understand ∆Σ modulators and substrate couplings. An intensive theoretical background on generation, propagation and reception of substrate noise is presented in light of existing researches. System and behavioural level models are proposed to include the effects of substrate noise in the design stages. A maximum decay of 10dB is seen due to injection of substrate noise system level simulations while a decay of 12dB is seen in behavioural simulations. A solution is proposed using controlled clock tree delays to overcome the effects of substrate noise. The solution is verified on both the system and behavioural levels. The noise models used to drive the studies can further be used in mixed-signal systems to design custom solutions. / Den snabba utvecklingen inom halvledarindustrin har möjliggjort placering av flera marker på en enda dö. Detta har hjälpt till att öka funktionaliteten hos moderna applikationsspecifika integrerade kretsar. Sålunda placeras digitala kretsar i allt högre grad parallella och RF-kretsar i de så kallade blandade signalkretsarna. Som ett resultat har bullerkopplingarna genom substratet nu en ökad roll i ASICdesign med blandad signal. Därför finns det behov av att studera effekterna av substratbuller och inkludera dem i den traditionella designmetoden. ∆Σ analog-till-digital omvandlare är ett perfekt exempel på digital integration i traditionellt analoga kretsar. ADC, som används för att gränssnitta digitala kretsar till en analog värld, är oumbärliga i blandningssignalsystem och är därför en intressant fallstudie. A ∆Σ arkitektur används i denna avhandling för att studera effekterna av substratstörning. En bakgrundsstudie presenteras i avhandlingen för att bättre förstå ∆Σ modulatorer och substratkopplingar. En intensiv teoretisk bakgrund på generering, förökning och mottagande av substratbuller presenteras i ljuset av befintliga undersökningar. Systemoch beteendemodellmodeller föreslås inkludera effekterna av substratbuller i konstruktionsstadiet. Ett maximalt förfall på 10dB ses på grund av injektion av substratbuller på systemnivå medan ett förfall av 12dB ses i beteende simuleringar.En lösning föreslås med hjälp av kontrollerade klockträdfördröjningar för att övervinna effekterna av substratbuller. Lösningen är verifierad på både system och beteendenivåer. De brusmodeller som används för att driva studierna kan vidare användas i blandningssignalsystem för att designa anpassade lösningar.