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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 1 to 10 of 28 (0.09 seconds)Spelling suggestions: "subject:"all grid array technology"" "subject:"fall grid array technology""
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Experimental evaluation of board level solder joint reliability of plastic ball grid array assemblies with eutectic Pb-Sn and Pb-free solders /Lui, Hoi Wai. January 2003 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 103-114). Also available in electronic version. Access restricted to campus users.
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Computational drop testing of printed circuit boards with BGA componentsJordy, Daniel Edward. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.
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Experimental investigation on testing conditions of solder ball shear and pull tests and the correlation with board level mechanical drop test /Song, Fubin. January 2007 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 163-172). Also available in electronic version.
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Principal component regression models for thermo-mechanical reliability of plastic ball grid arrays on CU-core and no CU-core PCB assemblies in harsh environmentsShirgaokar, Aniket, Lall, Pradeep. January 2009 (has links)
Thesis--Auburn University, 2009. / Abstract. Vita. Includes bibliographic references (p.80-97).
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Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders /Huang, Xingjia. January 2003 (has links)
Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
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An investigation of BGA electronic packaging using Moiré interferometryRivers, Norman. January 2003 (has links)
Thesis (M.S.M.E.)--University of South Florida, 2003. / Title from PDF of title page. Document formatted into pages; contains 87 pages. Includes bibliographical references.
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PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronicsMitchell, Charles Clayton, January 2006 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.
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Development of nano-characterization system for polymer film measurement and single BGA solder joint forming experimentReichman, Aaron Michael. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science (Mechanical Engineering), 2007. / Includes bibliographical references.
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Models for thermo-mechanical eliability trade-offs for ball grid array and flip chip packages in extreme environmentsHariharan, Ganesh, Lall, Pradeep. January 2007 (has links) (PDF)
Thesis(M.S.)--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references.
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Thermal performance of ball grid arrays and thin interface materialsElkady, Yasser Ahmed, Suhling, J. C. Knight, Roy Ward. January 2005 (has links) (PDF)
Dissertation (Ph.D.)--Auburn University, 2005. / Abstract. Vita. Includes bibliographic references.
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