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Multiphase binary diffusion in the silver-zinc system /Williams, David Slate January 1978 (has links)
No description available.
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Advanced titanium based laminates for high temperature applicationsZuo, Yong Qiang January 1997 (has links)
No description available.
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Effect of surface cleanliness on solid phase bonding of copper in ultrahigh vacuumNagpal, Vijay 12 1900 (has links)
No description available.
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Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devicesPluess, Christoph 10 September 2004 (has links)
Graduation date: 2005
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Solid state diffusion kinetics of intermetallic compound formation in composite soldersSees, Jennifer Anne. January 1993 (has links) (PDF)
Thesis (Ph.D.)--University of North Texas, 1993. / Major Professor: James L. Marshall. Includes bibliographical references.
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Diffusion kinetics and microstructure of eutectic and composite solder/copper jointsWu, Yujing. January 1994 (has links) (PDF)
Thesis (Ph.D.)--University of North Texas, 1994. / Includes bibliographical references.
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Nickel nanoparticles-assisted diffusion brazing of stainless steel 316 for microfluidic applications /Tiwari, Santosh K. January 1900 (has links)
Thesis (Ph. D.)--Oregon State University, 2010. / Printout. Includes bibliographical references. Also available on the World Wide Web.
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Self-diffusion in alpha brassArmijo, Joseph Sam, 1938- January 1962 (has links)
No description available.
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An internal convective heating technique for diffusion bonding highly parallel microchannel architectures /Bose, Sumantra. January 2008 (has links)
Thesis (M.S.)--Oregon State University, 2009. / Printout. Includes bibliographical references (p. 93-94). Also available on the World Wide Web.
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Diffusion bonding of large substrate MECS devices based on differential thermal expansion /Chintapalli, Prashanth. January 1900 (has links)
Thesis (M.S.)--Oregon State University, 2007. / Printout. Includes bibliographical references (leaves 61-63). Also available on the World Wide Web.
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