Abstract Grinding introduces unavoidable residual stresses of significant but unknown magnitudes. The effect of residual stresses in surface integrity is related to the nature of the residual stresses which relies purely on the process parameters and the workmaterial properties. It is a well-known fact that the fatigue strength of a ground component is increased by introducing compressive stresses. On the other hand, fatigue cracks may originate at regions of maximum tensile stress and usually at the surface of the material. Moreover, stress corrosion cracking is another consequence of critical surface tensile stress. Added to that, the residual stresses may result in dimension alteration and surface distortion, particularly for thin products such as plates. The beneficial effects of compressive residual stresses have been widely recognized in industry. The wise application of such a principle would bring about improved economical use of parts subjected to fatigue loading and aggressive environmental conditions. Therefore a better understanding of residual stress mechanisms is necessary to increase the dimensional accuracy and improve the surface integrity of ground elements, particularly for parts with high precision and manufactured by automated production lines. Consequently, the development of reliable models for predicting residual stresses is of great value in reducing the amount of measurements and experimental tests of residual stresses. Unfortunately, little effort has been devoted so far to develop appropriate models to take into account grinding conditions, workmaterial properties and boundary conditions. This thesis aims to investigate the residual stress mechanisms induced by grinding in terms of grinding parameters. In order to obtain a full understanding, both the roles of individual factors causing residual stresses (i.e. mechanical, thermal and phase transformation) and their couplings were carefully studied with the aid of the finite element method. The studies include: (1) residual stresses due to thermal grinding conditions, (2) residual stresses due to iso-thermal mechanical grinding conditions, (3) coupling of thermo-mechanical conditions, (4) coupling of thermo-phase transformation, and (5) the full coupling of all the factors. It is found that under sole thermal grinding conditions, the heat flux associated with up-grinding may lead to a higher grinding temperature compared with that of down-grinding. A constant flux introduces the least temperature rise if the total grinding energy is the same. Higher convection heat transfer not only decreases the grinding temperature but also makes the temperature rise occur mainly within a thin surface layer. A similar effect can be achieved by applying higher table speeds. When the grinding temperature is less than the austensing temperature, surface residual stresses are tensile. The heat generated within the grinding zone causes a very non-uniform temperature field in the workpiece. The part of the workmaterial subjected to a higher temperature rise expands more significantly and causes compressive stresses because of the restraint from its surrounding material that expands less. When the surface heat flux moves forward, the material outside the grinding zone contracts under cooling. Since the workmaterial has been plastically deformed during thermal loading, the contraction is restrained and thus a tensile stress field is generated locally. If a workpiece material experiences a critical temperature variation in grinding, phase transformation takes place and a martensite layer appears in the immediate layer underneath the ground surface. It was found that the growth of martensite develops a hardened zone with a higher yield stress that expands with the movement of the heat flux. A tensile surface residual stress is then developed. When the volume growth of material takes place during phase change, compressive residual stresses may also be generated. Under iso-thermal grinding conditions, it was found that plane stress is mainly compressive regardless of the distribution of surface traction and the direction of the tangential grinding force. With up-grinding, the residual stress in the grinding direction is always tensile. However, down-grinding may yield compressive surface residual stresses if the magnitude of the ratio of horizontal to vertical grinding forces is sufficiently large. Moreover, it is noted that discrete surface traction, which is more reasonable in terms of simulating the individual cutting of abrasive grits, would bring about more complex residual stress distribution that is very sensitive to the combined effect of individual cutting grits. If thermal and mechanical grinding conditions are coupled, a state free from residual stresses may be achieved if grinding heat is low and either the convection heat transfer or the table speed is high. However, it is found that the full coupling of the mechanical deformation, the thermal deformation and deformation by phase change results in tensile residual stresses. The effects of cooling and mechanical traction in this case however are minor. In summary, the research of this thesis explored the following: (a) grinding temperature development in terms of a wide range of grinding parameters together with the effect of temperature-dependent material properties, (b) the origin and onset of irreversible deformation due to mechanical loading, thermal loading and phase change under critical grinding conditions, (c) the effects of individual residual stress mechanisms and their partial and full couplings, and (d) the selection of grinding conditions to achieve beneficial residual stresses. Finally, based on the new findings in this research, a more comprehensive methodology is suggested for further study.

2 v. : / Title page, contents and abstract only. The complete thesis in print form is available from the University Library. / Thesis (D.E.)--Dept. of Electrical Engineering, University of Adelaide

Thesis (M. Phil.)--University of Hong Kong, 2006. / Title proper from title frame. Also available in printed format.

Thesis (M.S.)--West Virginia University, 2006. / Title from document title page. Document formatted into pages; contains xv, 147 p. : ill. (some col.). Includes abstract. Includes bibliographical references (p. 145-147).

Thesis (Ph. D.)--University of Texas at Austin, 2006. / Vita. Includes bibliographical references.

Thesis (Ph. D.)--Drexel University, 2006. / Includes abstract and vita. Includes bibliographical references.

Abstract Micro-electromechanical systems (MEMS) are subject to inevitable and inherent uncertainties in their dimensional and material parameters. Those lead to variability in their performance and reliability. Manufacturing processes leave substantial variability in the shape and geometry of the device due to its small dimensions and high feature complexity, while the material properties of a component are inherently subject to scattering. The effects of these variations have to be considered and a modeling methodology is needed in order to ensure required MEMS performance under uncertainties. Furthermore, in the design of high-Q micro-resonators, dissipation mechanisms may have detrimental effects on the quality factor (Q). One of the major dissipation phenomena to consider is thermoelastic damping, so that performances are directly related to the thermoelastic quality factor, which has to be predicted accurately. The purpose of this research is to develop a numerical method to analyze the effects of geometric and material property random variations on the thermoelastic quality factor of micro-resonators. The extension of the Perturbation Stochastic Finite Element Method (PSFEM) to the analysis of strongly coupled multiphysic phenomena allows the quantification of the influence of uncertainties, making available a new efficient numerical tool to MEMS designers. Résumé Dans le domaine des microsystèmes électromécaniques (MEMS), les micro-résonateurs jouent un rôle important pour le développement de micro-capteurs de plus en plus précis (ex : micro-accéléromètres). Dans cette optique daugmentation de la précision, les pertes dénergie qui limitent les performances des micro-résonateurs doivent être identifiées et quantifiées. Le facteur limitant des micro-résonateurs actuels est leur facteur de qualité thermo-élastique, qui doit donc être prédit de manière précise. De plus, suite à la tendance actuelle de miniaturisation et complexification accrues des MEMS, les sources de dispersions sont très nombreuses, à la fois sur les constantes physiques des matériaux utilisés et sur les paramètres géométriques. La mise au point doutils numériques permettant de prendre en compte les incertitudes de manière efficace est donc primordiale afin daméliorer les prestations densemble du microsystème et dassurer un certain niveau de robustesse et de fiabilité. Le but de cette recherche est de développer une méthode numérique pour analyser les effets des variations aléatoires des propriétés matérielles et géométriques sur le facteur de qualité thermo-élastique de micro-résonateurs. Pour ce faire, lapproche dite perturbative de la méthode des éléments finis stochastiques (PSFEM) est étendue à lanalyse de phénomènes multiphysiques fortement couplés, fournissant ainsi aux acteurs de lindustrie des MEMS un nouvel outil de conception efficace.

Modeling of the time-dependent behavior of cement paste has always been a difficulty. In the past, viscoelastic behavior of cementitious materials has been primarily attributed to the viscoelastic properties of C-S-H components. Recent experimental results show that C-S-H may not exhibit as much creep and relaxation as previously thought. This requires new consideration of different mechanisms leading to the viscoelastic behavior of cement paste. Thus the objective of this thesis is to build a computational model using finite element method to predict the viscoelastic behavior of cement paste, and using this model, virtual tests can be carried out to improve understanding of the mechanisms of viscoelastic behavior. The primary finding from this thesis is that the apparent viscoelastic behavior due to dissolution of load bearing phases is substantial. The dissolution process occurring during the hydration reaction can change the stress distribution inside cementitious materials, resulting in an apparent viscoelastic behavior of the whole cementitious materials. This finding requires new consideration of mechanisms of time-dependent behavior of cementitious materials regarding the dissolution process of cement paste.

Hydrocephalus is a clinical conditon where the brain tissue is deformed by the expanding ventricules. In this thesis, the mechanical deformation of a hydrocephalic brain is studied using a biomechanical model, where the material properties of the tissue are described by a viscoelastic model. A set of governing equations is derived when the motion is quasi-static motion and deformation is small. Then, finite element method is used for spatial discretization, and finite difference and trapezoidal rule are used for time-stepping. Moreover, the computational meshes are generated from medical images of patient's brain using level set method and a program called DistMesh. Numerical stability of the time-stepping scheme is also studied. <br /><br /> Several numerical studies are conducted to investigate several aspect of the brain with hydrocephalus. The state of stress of the tissue is found to be compressive everywhere in the brain. The viscoelastic properties of the brain are investigated and found to be dominated by elastic response. Lastly, the displacement made by the ventricular wall as it expands and shrinks is found to be non-uniform.

In this paper a continuous Galerkin multiscale method (CGMM) and a discontinuous Galerkin multiscale method (DGMM) are proposed, both based on the variational multiscale method for solving partial differential equations numerically. The solution is decoupled into a coarse and a fine scale contribution, where the fine-scale contribution is computed on patches with localized right hand side. Numerical experiments are presented where exponential decay of the error is observed when increasing the size of the patches for both CGMM and DGMM. DGMM gives much better accuracy when the same size of the patches are used.