Abstract Silicon carbide is a versatile material amenable to variety of applications from electrical insulation to surface passivation, diffusion-barrier in optoelectronic and high-frequency devices. This research presents a fundamental study of a-SiC:H films with variable stoichiometries deposited using novel technique, DC saddle-field plasma-enhanced chemical-vapour deposition, a departure from conventional RF PECVD commonly used in industry. DCSF PECVD is an alternative technique for low temperature large area deposition. Stoichiometric a-SiC:H obtained by fine-tuning precursor gas mixture. Annealing up to 800oC showed no significant change in elemental composition; particularly indicating thermal stability at stoichiometry. Ellipsometry showed wide range of optical gaps whose maximum surpasses values reported in literature. Refractive index measured and change in values studied as function of increasing carbon content in the films. Also attainment of very smooth surface morphology for stoichiometric a-SiC:H films reported. Surface roughness of 1 nm rms demonstrated for films grown at temperature as low as 225oC.

Abstract Silicon carbide is a versatile material amenable to variety of applications from electrical insulation to surface passivation, diffusion-barrier in optoelectronic and high-frequency devices. This research presents a fundamental study of a-SiC:H films with variable stoichiometries deposited using novel technique, DC saddle-field plasma-enhanced chemical-vapour deposition, a departure from conventional RF PECVD commonly used in industry. DCSF PECVD is an alternative technique for low temperature large area deposition. Stoichiometric a-SiC:H obtained by fine-tuning precursor gas mixture. Annealing up to 800oC showed no significant change in elemental composition; particularly indicating thermal stability at stoichiometry. Ellipsometry showed wide range of optical gaps whose maximum surpasses values reported in literature. Refractive index measured and change in values studied as function of increasing carbon content in the films. Also attainment of very smooth surface morphology for stoichiometric a-SiC:H films reported. Surface roughness of 1 nm rms demonstrated for films grown at temperature as low as 225oC.

Notre étude concerne la mise en place et le développement de dépôts de carbure de silicium amorphe hydrogéné (a-SiCx:H) à basse température (370°C), par voie PECVD, sur un réacteur PECVD semi-industriel à faible fréquence (440 kHz). Les propriétés chimiques, optiques et de passivation de surface des couches déposées sont analysées et l’impact du changement des débits de gaz précurseurs (silane et méthane) est aussi étudié. La possibilité d’utiliser le a-SiCx:H comme couche anti-reflet en face avant d’une cellule solaire est envisagée. Bien que l’indice de réfraction d’une couche riche en carbone soit en accord avec la condition de lame quart-d’onde requise pour une couche anti-reflet, le coefficient d’extinction est trop élevé en raison de la proportion significative de silicium dans la couche. Cette absorption peut être atténuée par l’incorporation d’azote dans la couche (a-SiCxNy:H). En revanche, la passivation de surface s’améliore lorsque la quantité de silane augmente. La plus faible vitesse de recombinaison de surface atteinte sur les échantillons après dépôt est de 10 cm.s. / Our study deals with the deposition of amorphous hydrogenated silicon carbide (a- SiCx:H) at low temperature (370°C), by PECVD technique, using a semi-industrial lowfrequency PECVD reactor (440 kHz). The deposited films are analyzed for chemical, optical and surface passivation properties, and the impact of the gas flow parameters (silane and methane) is studied. The possible use of a-SiCx:H as an antireflective coating at the front side of solar cells is investigated. Although the refractive index for high carbon concentration could be in agreement with the demand of quarter-wave layer for antireflective coating, the extinction coefficient remains too high due to a significant silicon content in the material. This absorption can be attenuated by incorporating nitrogen in the layer. However, the surface passivation improves with the silane proportion. The lowest surface recombination velocity of an as-deposited samples is about 10 cm.s.