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Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 163-164).

Thesis (Ph. D.)--University of Washington, 1994. / Vita. Includes bibliographical references (leaves [160]-175).

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Ronald L. Panton. Vita. Includes bibliographical references.

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2007. / Includes bibliographical references (leaves 94-97). Also available in electronic version.

<p>Packaging of high density integrated circuits offers many challenges in the electronics industry today. Advanced requirements for high performance computing are starting to take advantage of multichip modules that are smaller in size and weight, use less energy, and cost less than prior technologies. This project and report provides a summary of the processes of multichip module packaging and describes some of the companies and their technologies currently involved in the industry today. An advanced computer system is proposed that would require a high density multichlp module. Functional requirements and performance specifications are identified for the system.</p> <p> Many design decisions are required to determine the best integrated circuit package for the system, with trade-off analysis being key in the selection process. One comparative analysis worthy of study is the evaluation of high density interconnection alternatives. Two technologies of multichip module designs are compared using the Analytic Hierarchy Process. Main attributes of the alternatives are chosen that are key to thp design and have significant differences. The attributes are defined in detail and weighted based on their importance to the model. Performance data is also used in the comparisons of alternatives.</p> <p> A spreadsheet program was developed to quickly enter the weighted values and performance data, perform the matrix calculations, and determine the final rankings of the alternatives. Sensitivity analysis was then applied to determine what effect a change in the value of a particular attribute had on the outcome of the rankings. Results of the sensitivity analysis for key attributes are graphically plotted.</p> / Master of Science

The purpose of this research is to develop an understanding of Multichip Modules, (MCMs), more specific those fabricated with a Low Temperature Co-fireable Ceramic (L TCC) tape systems. The study will consist of designing, processing, and testing two generic MCM test patterns. The effects on signal propagation caused by vias and wire bonds, crosstalk for surface and embedded transmission lines, crosstalk between vias, effects of bends in transmission lines are studied and discussed in this work. Time Domain and Frequency Domain measurements are performed and presented in this thesis work for electrical characterization of MCM structures using L TCC systems / Master of Science