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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
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Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
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Showing 31 to 40 of 49 (0.088 seconds)Spelling suggestions: "subject:"multichip modules (microelectronics)"" "subject:"multichip modules (icroelectronics)""
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Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramicHayth-Perdue, Wendy 04 March 2009 (has links)
An Underwater Digital Signal Processor (UDSP) multichip module (MCM) was designed and fabricated according to specifications outlined by the Naval Surface Warfare Center (NSWC), Dahlgren Division. Specifications indicated that low temperature cofired ceramic (L TCC) technology be used to fabricate the MCM with surface dimensions of 2"x2". The top surface of the module was to be designed to enclose mounted components and bare dice, and the bottom surface was to be equipped with a 144 pin grid array (PGA). The LTCC technology selected for this application incorporated DuPont's 951 Green Tape™ and compatible materials and pastes. A mixed metal system using inner silver system and outer surface gold system was used. Harris Corporation's FINESSE MCMTM, a computer-aided design (CAD) tool, was used to design the surface components and produce the circuit layout. FREESTYLE MCM™, an autorouter, was used to accomplish the routing of the signal layers. The design information provided by FINESSE MCM™ and FREESTYLE MCM™ was utilized to produce the artwork necessary for fabrication. Fabrication of the module was accomplished in part using thick film processes to produce the conducting areas on each layer. The layers were stacked in a press, laminated, and fired. Conducting areas were screen printed on the top surface of the module for wire bonding and on the bottom surface of the module for pin attachment.
The main objectives of this thesis work were to convert silicon UDSP MCM to ceramic using LTCC, learn a new tool in CAD design that incorporates an autorouter, apply the tool to design a MCM-C module, and to develop criteria to evaluate the MCM. Future research work includes conducting line continuity testing, materials evaluation to determine reactions at interfaces and via filling, and resistance and electrical crosstalk measurements on the module. / Master of Science
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| 32 |
Microwave/millimeter wave multi-layer organic based interconnectsPham, Anh-Vu Huynh 08 1900 (has links)
No description available.
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| 33 |
A parallel digital interconnect test methodology for multi-chip module substrate networksNewman, Kimberly Eileen 05 1900 (has links)
No description available.
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| 34 |
Analysis of interconnect yield for a high throughput flip chip assembly processMcGovern, Lawrence P. 12 1900 (has links)
No description available.
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| 35 |
Flip chip on flex for low cost electronics assemblyVenton, Jennifer Lynne 12 1900 (has links)
No description available.
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| 36 |
Advanced encapsulation processing for low cost electronics assemblyPascarella, Nathan William 12 1900 (has links)
No description available.
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| 37 |
High power flip-chip light emitting diode /Lai, Yin Hing. January 2004 (has links)
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2004. / Includes bibliographical references (leaves 60-68). Also available in electronic version. Access restricted to campus users.
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| 38 |
Viscoelastic stress analysis and fatigue life prediction of a flip-chip-on-board electronic package /Koeneman, Paul Bryant, January 1999 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 110-112). Available also in a digital version from Dissertation Abstracts.
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| 39 |
Study of thermo-mechanical reliability of area-array packagesHanna, Carlton Eissey 08 1900 (has links)
No description available.
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| 40 |
Reworkable high temperature adhesives for Multichip Module (MCM-D) and Chip-on-Board (COB) applicationsPike, Randy T. 08 1900 (has links)
No description available.
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