Thesis (Ph. D.)--Royal Institute of Technology, 1980. / This thesis also includes 6 related papers. Includes bibliographical references.

Thesis (Ph. D.)--Royal Institute of Technology, 1980. / This thesis also includes 6 related papers. Includes bibliographical references.

Thesis (M.S.)--Oregon State University, 1970. / Typescript (photocopy). Includes bibliographical references (leaves 132-136). Also available on the World Wide Web.

Thesis (M.S.)--Oregon State University, 1983. / Typescript (photocopy). Includes bibliographical references (leaves 52-53). Also available on the World Wide Web.

No description available.

The objectives of the thesis were to investigate the adhesives influence on the mechanical properties in laminated multi-layer paperboard. The study also strived to find a method to investigate the interface strength of the adhesive layer. This was investigated by constructing handsheets of laminated paperboard by gluing a bulky, CTMP center ply, Chromofoil, of two different grammages, 290 g/m2 and 360 g/m2, together with two outer plies of ordinary copy paper, Multi- Copy 80 g/m2. The sheets were glued with two types of dispersion adhesives, a starch based adhesive and a polyvinyl acetate based adhesive. Twelve types of test specimens were constructed and tested in a series of mechanical tests, which involved a tensile test, a two-point bending test and a Scott Bond test. The method called “digital image correlation” was used trying to investigate the interface strength of the adhesive layer. The study also involved an evaluation of the possibility to predict the bending stiffness of laminated multi-layer paperboard by using calculations according to classic laminate theory. The results show that it is fully possible to use these calculated values as a prediction, with low risk of overestimating the bending stiffness of the paperboard and without involving the adhesive layer in the calculation. The method provided high absolute values in bending and tensile properties, which increased with increasing amount of glue applied. This came at the cost of grammage, which lead to low index values. The overall conclusion is that the effect from the adhesives is somewhat negative, since the mechanical properties would have been improved if the adhesive had been replaced with more fiber. The major source of errors during the experiments was the roughness of the manufacturing method. This lead to an uncertainty about whether the right amount of adhesive had been applied to the test specimens. Due to this the validity of the results could be questioned. Digital image correlation proved to be a rather sensitive method that requires a high accuracy setup and execution for it to be applicable in this type of study. The failure mode of the glue seam correlated well to the amount of glue applied. A lower amount of adhesive applied increases the likeliness of failure of the glue seam.

Thesis (M.S.)--University of Wisconsin--Madison, 1985. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 92-97).

Thesis (M.S. in Econ.)--School of Economics, Georgia Institute of Technology, 2004. Directed by Haizheng Li. / Includes bibliographical references (leaves 47-49).

This master thesis has its main focus within embossing operations and how different factors influence the result. The work was performed at Stora Enso Research Centre in Karlstad, Sweden. Embossing is relatively complex operation to analyze since the paperboard can be exposed of both bending, shear and compression at the same time. The techniques used today for evaluating embossing on paperboard consist of experimental setups. These experimental techniques needed to be complemented in order to simplify the approach for embossing evaluations. The aim of this thesis was to develop a simulation material model, created with Finite Element Method by using Abaqus (2014), which capture the experimental behavior of embossed paperboard. The goals were to understand which material properties that are of high importance in embossing operations, and how sensitive the simulation material model is at small geometry changes of the embossing tool. A three dimensional finite element material model has been created in Abaqus (2014). The analysis was performed as dynamic quasi-static where an implicit solver was used. The simulation material model consisted of a continuum model, which describes the behavior of the plies, and an interface model implemented as cohesive elements, which describes the inelastic delamination between the plies. The continuum model was defined as an anisotropic linear elastic-plastic material model with isotropic linear hardening together with Hill´s yield criterion. The interface model was defined with an anisotropic elastic-plastic traction-separation law and an exponential damage evolution model. The purpose of the experimental tests was to capture the behavior of embossed paperboard and the goal was then to recreate the behavior in the simulation model. The results in this thesis focus on the relationship between the applied force and the displacement. An experimental and numerical study of out-of-plane compression has also been conducted, where the aim was to determine the out-of-plane elastic modulus, EZD. According to embossing results, the embossing results showed an exponential hardening behavior while the numerical results, unfortunately, showed a declining hardening behavior. Despite this, some understanding regarding which parameters that are of utmost importance have been achieved. The material parameters which had the highest influence on embossed paperboards seem to be the out-of-plane shear properties. This thesis also shows that the material model is sensitive of small changes of the tool geometry. The proportion of shear, bending and compression are strongly dependent on if the tool has sharp edges or if the edges are more rounded.

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