Environmental challenges, such as global warming, growing demand on energy, and diminishing oil sources have accelerated research on alternative energy conversion methods. Thermoelectric power generation is a promising method to convert wasted heat energy into useful electrical energy form. A temperature gradient imposed on a thermoelectric device produces a Seebeck potential. However, this temperature gradient causes thermal stresses due to differential thermal expansions and mismatching of the bonded components of the device. Thermal stresses are critical for thermoelectric devices since they can generate failures, including dislocations, cracks, fatigue fractures, and even breakdown of the entire device. Decreases in power-generation performance and operation lifetime are major consequences of these failures. In order to minimize thermal stresses in the legs without affecting power-generation capabilities, this study concentrates on structural solutions. Thermoelectric devices with non-segmented and segmented legs were modeled. Specifically, the possible effect of various leg geometries, configurations, and dimensions were evaluated using finite-element and statistical methods. Significant changes in the magnitudes and distributions of thermal stresses occurred. Specifically, the maximum equivalent stresses in the rectangular-prism and cylindrical legs were 49.9 MPa and 43.3 MPa, respectively for the temperature gradient of 100ºC. By using cylindrical legs with modified dimensions, decreases in the maximum stresses in legs reached 21.2% without affecting power-generation performance. Moreover, the effect of leg dimensions and coaxial-leg configurations on power generation was significant; in contrast, various leg geometries and rotated-leg configurations had very limited affect. In particular, it was possible to increase power output from 20 mW to 65 mW by simply modifying leg widths and heights within the defined range. It should be noted, however, this modification also increased stress levels. It is concluded that leg geometries, configurations, and dimensions can be redesigned for improved durability and overall performance of thermoelectric devices.

Ces travaux portent sur la micromanipulation, manipulation des objets dont la taille est comprise entre 1 micron et 1 mm. Le comportement de ces objets est fortement perturbé par les forces d'adhésion et les forces surfaciques, rendant les tâches de manipulation complexes et peu répétables. Nous démontrons que l'immersion des micro-objets artificiels dans l'eau permet de réduire sensiblement ces forces par rapport à l'air ou le vide.<br />Dans ce contexte, nous proposons un principe innovant de micromanipulation immergée par changement de phase. Le micro-objet est saisi à l'aide d'un microvolume de glace créé dans l'eau et relâché par fonte de la glace sans effets perturbateurs dus aux forces d'adhésion. Le prototype expérimental réalisé a permis de valider ce principe sur des objets d'une taille typique de 600 microns. L'étude du fonctionnement du système, basé sur deux modules à effet Peltier, nécessite une modélisation thermique que nous proposons de mener en utilisant l'analogie électrique. La modélisation de géométries de type élancée, semblable à celle d'un radiateur de notre système et également couramment utilisée dans les micro-actionneurs thermiques, a été effectuée. Cette étude originale dépasse notre cadre applicatif, pouvant être utilisée plus généralement dans les microsystèmes thermiques. Cet outil de modélisation thermique a aussi conduit à la modélisation du prototype, validée expérimentalement. <br />Ces travaux ont permis la production d'un outil de simulation thermique pour les microsystèmes et d'une méthode de micromanipulation originale et prometteuse. Les perspectives portent sur l'étude de la commande du système afin d'être implanté dans un contexte applicatif.

Ce travail de recherche traite des alliages à mémoire de forme (AMF) utilisés en tant qu'actionneurs dans les microrobots et les microsystèmes. Parmi les AMF, l'alliage de nickel-titane (NiTi) est notamment un très bon candidat au micro-actionnement, car il est capable de développer un travail mécanique très important, en comparaison avec d'autres matériaux actifs. Cependant, la température étant sa grandeur de commande, le temps de réponse de l'AMF est grand. De plus, il est difficile de contrôler précisément ses déplacements, car il reste très sensible aux conditions thermiques extérieures. Aussi, ce travail présente une étude thermique détaillée, fondée sur le modèle physique de comportement d'un AMF, des deux principaux moyens de chauffage et de refroidissement du matériau : l'effet Joule et l'effet Peltier. Cette étude a abouti à la réalisation d'un micro-actionneur à effet Peltier intégré (nommé module $\Omega$ Peltier). Cet actionneur original a la particularité de rendre l'AMF moins sensible aux variations de la température extérieure et peut donc fonctionner en milieu confiné, ce qui est impossible avec un actionneur à effet Joule. Un simulateur numérique, mis au point dans cette étude, permet de comprendre et de prédire le comportement thermomécanique du module $\Omega$.

Thermoelectric devices are capable of providing both localized active cooling and waste heat power generation. This work will explore the possibility of embedding thermoelectric devices within electronic packaging in order to achieve better system performance. Intel and Nextreme, Inc. have produced thin-film superlattice thermoelectric devices that have above average performance for thermoelectrics and are much thinner than most devices on the market currently. This allows them to be packaged inside of the electronic package where the thermoelectric devices can take advantage of the increased temperatures and decreased thermal lag as compared to the devices being planted on the outside of the package. This work uses the numerical CFD solver FLUENT and the analog electronic circuit simulator SPICE to simulate activity of thermoelectric devices within an electronics package.

Micro-scale self assembly is an attractive method for manufacturing sub-millimeter sized thermoelectric device parts. Challenges controlling assembly yield rates, however, have caused research to find novel ways to implement the process while still resulting in a working device. While a typical system uses single n-type and p-type material elements in series, one method used to increase the probability of a working device involves adding redundant parallel elements in clusters. The drawback to this technique is that thermal performance is affected in clusters which have missing elements. While one-dimensional modeling sufficiently describes overall performance in terms of average junction temperatures and net heat flux, it fails when a detailed thermal profile is needed for a non-homogeneous system. For this reason, a three-dimensional model was created to describe thermal performance using Ansys v12.1. From the results, local and net performance can be described to help in designing an acceptable self-assembled device. In addition, a haptic thermal display was designed using thermoelectric elements with the intention of testing the thermal grill illusion. The display consists of 5 electrically independent rows of thermoelectric elements which are controlled using pulse width modulating direct current motor controllers.

The thermoelectric effect was discovered well over a century ago, yet performance has not shown improvement until recent years. Prior work has shown that the thermoelectric effect can be enhanced by the use of microscale pieces of thermoelectric material. Conventional assembly techniques are inadequate to deal with parts of this size, making it necessary to find a suitable alternative before these devices can be made economically. Capillary self-assembly is a promising alternative to conventional techniques. This method employs the use of preparing substrates with areas of favorable surface tension to place and align parts. Still, many obstacles have to be overcome to adapt this process for use of constructing thermoelectric coolers. The goal of this work is to overcome these obstacles and assess the viability of self-assembly for fabricating these devices. In effort to make the method more effective a process for creating more uniform deposits of solder is also assessed. This work shows that microscale thermoelectric elements can be assembled into functional thermoelectric devices using self-assembly techniques through the assembly of coolers in experimental work.

Computers and their constituent electronics continue to shrink. The same amount of work can be done with increasingly smaller and cheaper components that need less power to function than before. In wireless sensor networks, the energy needed by one sensor node borders the amount that is already present in its immediate surroundings. Equipping the electronics with a micro generator or energy harvester gives the possibility that it can become self-sufficient in energy. In this thesis two kinds of energy harvesters are investigated. One absorbs vibrations and converts them into electricity by means of piezo-electricity. The other converts heat flow through a semiconductor to electricity, utilizing a thermoelectric effect. Principles governing the performance, actual performance of off-the-shelf components and design considerations of the energy harvester have been treated. The thermoelectric micro generator has been measured to output power at 2.7 mW and 20°C with a load of 10 W. The piezoelectric micro generator has been measured to output power at 2.3 mW at 56.1 Hz, with a mechanical trim weight and a load of 565 W. In these conditions the power density of the generators lies between 2-3 W/m2.

No description available.

O presente trabalho apresenta o desenvolvimento de uma bancada didática de baixo custo para estudo dos materiais termoelétricos para a realização de ensaios de obtenção de curvas de desempenho dos módulos termoelétricos no que se refere a geração de energia pelo Efeito Seebeck e resfriamento através do Efeito Peltier de forma a difundir os conhecimentos nas áreas afim em escolas de Engenharia, refletindo na compreensão dos princípios e funcionalidades destas tecnologias. O sistema proposto permite ler simultaneamente até 3 geradores termoelétricos, e é composto por dois principais circuitos eletrônicos: sendo um estágio aquisição de dados compostos por 3 canais para leitura de tensão, 3 canais para corrente e 6 canais para aquisição do sinal dos termopares (<400°C) além de sistema térmico que terá as funções de aquecimento e resfriamento. Os dados medidos são adquiridos para um computador com um software customizado a aplicação que permite o monitoramento das grandezas envolvidas (tensão, corrente, potência e temperatura) para acompanhamento do ensaio dos materiais termoelétricos, tanto por meio de uma indicação numérica como gráfica. O sistema de aquisição de dados possui precisa o para temperatura de ±2,5%, para tensão de ±2,5% e para corrente de ±1,5%. / The present work describes the development of a low cost didactic bench for Study of thermoelectric materials for performing obtaining performance curves testing of thermoelectric modules in regard to energy generation effect Seebeck and cooling via Peltier Effect order to disseminate knowledge in areas related to engineering schools, reflecting the understanding of the principles and features of these technologies. The proposed system can be read simultaneously up to 3 thermoelectric generators, and consists of two main electronic circuits: being a stage data acquisition composed of 3 channels for reading voltage and 3 channels for current using ACS712 instrumentation amplifiers and 6 channels signal acquisition thermocouples (<400 ° C) as well as thermal system will have the heating and cooling functions. The measured data is acquired to a computer with software developed in Delphi language, which allows monitoring of the quantities involved (voltage, current, power and temperature) to monitor the testing of thermoelectric materials, either through a digital display as a graphic . The data acquisition system has a temperature accuracy to ± 2,5% to ± 2.5% voltage and current of ± 1.5%.

Made available in DSpace on 2014-12-17T15:14:45Z (GMT). No. of bitstreams: 1 EdvaldoOA.pdf: 2541232 bytes, checksum: 164028ab1f903bc208dbe7b7dc61aedb (MD5) Previous issue date: 2007-12-13 / Thermoelectric Refrigerators (TEC Thermoelectric Cooling) are solid-state heat pumps used in applications where stabilization of temperature cycles or cooling below the room temperature are required. TEC are based on thermoelectric devices, and these in turn, are based on the Peltier effect, which is the production of a difference in temperature when an electric current is applied to a junction formed by two non-similar materials. This is one of the three thermoelectric effects and is a typical semiconductor junction phenomenon. The thermoelectric efficiency, known as Z thermoelectric or merit figure is a parameter that measures the quality of a thermoelectric device. It depends directly on electrical conductivity and inversely on the thermal conductivity. Therefore, good thermoelectric devices have typically high values of electrical conductivity and low values of thermal conductivity. One of the most common materials in the composition of thermoelectric devices is the semiconductor bismuth telluride (Bi2Te3) and its alloys. Peltier plates made up by crystals of semiconductor P-type and N-type are commercially available for various applications in thermoelectric systems. In this work, we characterize the electrical properties of bismuth telluride through conductivity/resistivity of the material, and X-rays power diffraction and magnetoresistance measurements. The results were compared with values taken from specific literature. Moreover, two techniques of material preparation, and applications in refrigerators, are discussed / Refrigeradores Termoel?tricos (TEC Thermoelectric Cooling) s?o bombas de calor de estado s?lido usados em aplica??es onde estabiliza??o de ciclos de temperatura ou para resfriamentos abaixo da temperatura ambiente s?o requeridos. Os TEC s?o baseados em dispositivos termoel?tricos e, estes, por sua vez s?o baseados no efeito Peltier, que consiste na produ??o de um diferencial de temperatura quando uma corrente el?trica ? aplicada a uma jun??o formada por dois materiais diferentes. Este efeito ? um dos tr?s efeitos termoel?tricos e ? um fen?meno t?pico de jun??o. A efici?ncia termoel?trica, conhecida como Z termoel?trico ou a figura de m?rito ? um par?metro que mede a qualidade de um dispositivo termoel?trico. Ele depende diretamente da condutividade el?trica e do inverso da condutividade t?rmica. Assim, bons dispositivos termoel?tricos devem apresentar valores elevados de condutividade el?trica e baixa condutividade t?rmica. Um dos materiais mais comuns na composi??o de dispositivos termoel?tricos ? o semicondutor telureto de bismuto (Bi2Te3) e suas ligas. Placas Peltier composta por cristais tipo P e Tipo N deste semicondutor s?o dispon?veis comercialmente para diversas aplica??es em sistemas termoel?tricos. Neste trabalho buscou-se caracterizar propriedades f?sicas de amostras de telureto de bismuto, extra?das de placas Peltier, atrav?s das medidas de condutividade/resistividade do material, de medidas de raios X e de magnetoresist?ncia. Os resultados foram comparados com valores da literatura da ?rea. Al?m disso, descrevemos duas t?cnicas de prepara??o destes semicondutores e discutimos aplica??es em refrigeradores