Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.

This master's thesis deals with issue of lead-free soldering in protective atmosphere with focus on wetting test. Theorethical part is focused on the types of lead-free solders, wettability tests performed on solder joints, different types of soldering or comparison of influence of the base material in regards to the wetting of the solder. The goal of practical part is testing and comparison of spreadability of selected lead-free solder on two conductive surfaces with different concentration of oxygen in protective nitrogen atmosphere. Testing has been performed on ceramic substrate which differs this method from others, performed on organic substrate. For an over-melted solder, the crystal-growth on surface in regards to protective atmosphere concentration is shown.

Copper (Cu) has been the main choice of the metallization in advanced IC package technology. The epoxy molding compounds (EMC) and the solder flux used in the packaging devices can release ionic impurities. In the halide environment, the electrochemical migration (ECM) failure and corrosion related failure of copper redistribution layer (RDL) and the Cu bond pads respectively was studied. Electrolytic migration arises when the IC package undergoes testing as per JESD22-A110 standards (130oC, 85% RH for 96/256 hrs.). Copper migration is fundamentally an ionic process that requires an electrolyte, moisture, and bias. To accelerate the time for investigating these failures, it was important to benchmark the metrology for real time observation of ECM failure under high voltage. Metrology for electrochemical defect analysis (MEDA) was developed to provide insight on failure mechanism. The Cu RDL on wafer level chip scale package devices were tested by PEG drop test (PDT) using non-aqueous polyethylene glycol (PEG) matrix doped with ions (Cl-, ClO4-, SO4-) to simulate EMC environment. PDT was conducted to analyze the real time migration behavior of Cu electrodes using a potentiostat and microscope. A novel Cu-selective passivation coating was applied on Cu either by wet processes or chemical vapor deposition (CVD) that are IC manufacturing compatible. This Cu-selective passivation coating is thermally stable, strongly adheres to Cu, corrosion resistant, low cost and shows good potential to prevent ECM defects at the high voltage bHAST condition. FTIR and potentiodynamic polarization were utilized to characterize the Cu-selective passivation coating. Statistically union of selected analytical techniques help to acquire unique results about the chemical systems. Together, electrochemistry and spectroscopy help to gather chemical information about the composition near and on the electrode. Additionally, during the SnAgCu (SAC) solder ball bonding on the Cu wafer by mass reflow process, solder flux is used to reduce the native oxides on Cu and SAC solder ball. Post cleaning, residual amount of the solder flux corrodes the Cu wafer. Passivation coating is used as an organic solder preservative to avoid the solder flux while facilitating a good bond between the SAC solder ball and Cu wafer. We investigated the efficiency of the passivation coating in preventing the copper thermal oxidation. The intermetallic compound formation between the Cu wafer and SAC solder ball was studied on 2nm, 6nm, 30nm and 50nm passivated Cu wafer. Based on the SEM/EDS analysis 1.7 µm CuxSny IMC was formed on 2nm coated cu wafer with a Cu:Sn ratio of 1.8:1 & 0.13:1.

Photonic crystals (PhCs) are periodic dielectric structures that exhibit a photonic band gap; a range of wavelengths for which light propagation is forbidden. 2D PhCs exhibit most of the properties as their three dimension counterparts with a compatibility with standard semiconductor processing techniques such as epitaxial growth, electron beam lithography, Plasma deposition/etching and electromechanical lapping/polishing. Indium Phosphide (InP) is the material of choice for photonic devices especially when it comes to realization of coherent light source at 1.55 μm wavelength. Precise engineering of the nanostructures in the PhC lattice offers novel ways to confine, guide and control light in phonic integrated circuits (PICs). Strong confinement of light in PhCs offer novel opportunities in many areas of physics and engineering. Dry etching, a necessary process step in PhC device manufacturing, is known to introduce damage in the etched material. Process induced damage and its impact on the electrical and optical properties of PhCs depends on the etched material, the etching technique and process parameters. We have demonstrated a novel post-etch process based on so-called mass-transport (MT) technology for the first time on InP-based PhCs that has significantly improved side-wall verticality of etched PhC holes. A statistical analysis performed on several devices fabricated by MT process technology shows a great deal of improvement in the reliability of optical transmission characteristics which is very promising for achieving high optical quality in PhC components. Several PhC devices were manufactured using MT technology. Broad enough PhC waveguides that operate in the mono/multi-mode regime are interesting for coarse wavelength de-multiplexing. The fundamental mode and higher order mode interaction creates mini-stop band (MSB) in the dispersion diagram where the higher order mode has a lower group velocity which can be considered as slow light regime. In this thesis work, the phenomena of MSBs and its impact on transmission properties have been evaluated. We have proposed and demonstrated a method that enables spectral tuning with sub-nanometer accuracy which is based on the transmission MSB. Along the same lines most of the thesis work relates to broad enough PhC guides that operated in the multimode regime. Temperature tuning experiments on these waveguides reveals a clear red-shift with a gradient of dλ/dT=0.1 nm/˚C. MSBs in these waveguides have been studied by varying the width in incremental amounts. Analogous to semiconductors heterostructures, photonic heterostructures are composed of two photonic crystals with different band-gaps obtained either by changing the air-fill factor or by the lattice constant. Juxtaposing two PhC and the use of heterostructures in waveguide geometry has been experimentally investigated in this thesis work. In particular, in multimode line defect waveguides the “internal” MSB effect brings a new dimension in single junction-type photonic crystal waveguide (JPCW) and heterostructure W3 (HW3) for fundamental physics and applications. We have also fabricated an ultra-compact polarization beam splitter (PBS) realized by combining a multimode waveguide with internal PhC. MSBs in heterostructure waveguides have shown interesting applications such as designable band-pass flat-top filters, and resonance-like filters with high transmission. In the course of this work, InGaAsP suspended membrane technology was developed. An H2 cavity with a linewidth of ~0.4 nm, corresponding to a Q value of ~3675 has been shown. InGaAsP PhC membrane is an ideal platform to study coupled quantum well/dot-nanocavity system. / <p>QC 20120831</p>

Au cours des dernières années, la demande de plus en plus forte pour des mémoires non-volatiles performantes, a mené au développement des technologies NOR Flash et NAND Flash, qui dominent aujourd'hui le marché des mémoires non-volatiles. Cependant, la miniaturisation de ces technologies, qui permettait d'en réduire le coût, laisse aujourd'hui entrevoir ses limites. En conséquence, des mémoires alternatives et émergentes sont développées, et parmi celles-ci, la technologie des mémoires à changement de phase, ou PCRAM, est l'une des candidates les plus prometteuses tant pour remplacer les mémoires Flash, notamment de type NOR, que pour accéder à de nouveaux marchés tels que le marché des SCM. Toutefois, afin d'être pleinement compétitives avec les autres technologies mémoires, certaines performances de la technologie PCRAM doivent encore être améliorées. Au cours de cette thèse, nous cherchons donc à obtenir des dispositifs PCRAM plus performants. Parmi les résultats présentés, nous réduisons les courants de programmation et la consommation électrique des dispositifs tout en augmentant la rétention de l'information à haute température. Pour cela, nous modifions la structure du dispositif ou nous utilisons un matériau à changement de phase alternatif. De plus, à l'aide de solutions innovantes, nous permettons aux dispositifs PCRAM de conserver l'information pendant une éventuelle étape de soudure de la puce mémoire. Enfin, nous avons conçu, développé et validé un procédé de fabrication permettant d'intégrer une diode PN de sélection en Silicium en série avec un élément résistif PCRAM, démontrant l'intérêt de ce sélecteur vertical pour être utilisées comme élément de sélection d'une cellule PCRAM intégrée au sein d'une architecture crossbar.

Cette thèse présente des résultats théoriques et expérimentaux portant sur des écoulements à l'échelle nanoscopique de polymères fondus. L'étude analytique et numérique de l'écoulement d'un film de polymère, préalablement nanostructuré par nanoimpression puis recuit au dessus de sa température de transition vitreuse, a permis de dégager différentes dynamiques de nivellement selon la topographie initiale du film. Certaines ont été appliquées à l'élaboration d'éléments optiques par recuit de nanostructures complexes. Une méthode de mesure de la viscosité Newtonienne et du temps terminal de relaxation d'un polymère déposé en film mince a également pu être développée. Enfin, un travail exploratoire portant sur un procédé de nanoimpression sans épaisseur résiduelle par démouillage est présenté. L'accent a porté sur le calcul précis de la pression de disjonction dans un milieu stratifié en utilisant la théorie moderne de Lifshitz basée sur les propriétés optiques des matériaux en interaction. / This thesis presents a theoretical and experimental work on nanoscale flows of polymer melts. Different leveling dynamics emerge from the analytical and numerical study of the reflow of a polymer film that is first nanoimprinted and then annealed above its glass transition temperature, depending on the initial topography of the film. These concepts were applied to the manufacturing of optical devices from the reflow of complex nanostructures. A method to measure the Newtonian viscosity and the terminal relaxation time of a thin polymer film was also developed. Finally, an exploratory work on a residual-layer-free nanoimprint process based on dewetting is presented. Emphasis was put on the accurate computation of the disjoining pressure in stratified media with the modern Lifshitz theory based on the optical properties of the interacting materials.

Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors soldering by using BiSn solder paste. Shear tests of SMD solder joints were realised and evaluated including isothermal ageing samples. At the end of master’s thesis solder joints visual aspects and defects were evaluated, measurement thickness of intermetallic compound by not only optical microscope but also SEM, discussion about results and Q was evaluated.

The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.

The work deals with research and development of a new method for ball-attach process, resp. reballing process of solder bumps on package with solder ball terminals (BGA, CSP, SOP, etc.), based on research and optimization of the parameters of the final terminals. The output is specially modified templates designed for placement of solder balls before reflow soldering. Three materially different templates were investigated in the work, in addition to the commonly used stainless steel, two other newly designed templates, which used ceramic materials (96% Al2O3a AlN) with thick-layer resistance heating. Proven advantages of the method using templates directly heated by electric current are the reduction of the thermal load of BGA packages in the first soldering process, as well as the creation of a better connection between the metallization of the case and the solder ball after final soldering to the printed circuit board. During the research, development and optimization of the method, tests of the created solder bumps were performed from the point of view of mechanical strength and internal structure. In the next part of the work, a research of solder bumps soldered using infrared heaters was performed in order to determine the influence of the heat flow direction in the process of reflow soldering. The heaters were successively placed in three positions, i.e. heating from the bottom of the housing, heating from the top and both heaters simultaneously. After sample preparation, metallographic cuttings and etching, the analysis of the internal structure of the entire solder ball and the intermetallic layer at the interface of the solder and the solder pad was performed. The work represents not only a new method of soldering solder bumps, but also new knowledge to create their internal structure, which contributes to meeting the increasingly demanding requirements to achieve the required reliability and quality.

This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.