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MODULAR AFFORDABLE GPS/INS (MAGI)Singh, Mahendra, McNamee, Stuart, Khosrowabadi, Allen 10 1900 (has links)
International Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevada / The GPS/INS equipment is used at the Air Force Flight Test Center (AFFTC) to collect
time space position information (TSPI) during testing. The GPS-based test
instrumentation is lagging behind available commercial technologies. Advancing
technologies for test use requires investigation of affordable commercial equipment. To
enable technology insertion for state of the art testing, there is a need for more robust,
flexible, reliable, modular, affordable low cost TSPI systems capable of operating in all
flight environments. Modular (plug-and-play) hardware and software, quick and easy to
re-configure, are required for supporting various test platforms from fighter aircraft to
cargo size aircraft. Flight testing dynamics are such that, GPS-only systems tend to lose
data during critical maneuvers. To minimize this data loss, inertial measurement systems
coupled with GPS sensors are used in most sophisticated range instrumentation packages.
However, these packages have required fairly expensive inertial units, are usually very
large and not very flexible in terms of quick and easy reconfiguration to meet the unique
needs of AFFTC’s test customers. WADDAN SYSTEMS has begun to address this
problem with a modular design concept, which incorporates their high-performance
navigation quality inertial measurement unit, but with costs comparative to that of lower-end
performance inertial units. This paper describes WADDAN’s concept and the
components that make up MAGI; and addresses some of the preliminary testing and near-term
proposed activities. In general, the system will provide GPS, inertial and discrete
MIL-STD 1553, RS-232/422 and video data from the participant. The MAGI will be
structured around the Compact personal computer interface (PCI) backplane bus with on-board
recording and processing and will include real-time command and control through
a UHF data link.
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Testbeam Measurements with Pixel Sensors for the ATLAS Insertable b-Layer ProjectGeorge, Matthias 07 May 2014 (has links)
No description available.
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Characterization of 3D silicon assemblies for ATLAS pixel upgradeBorri, Marcello January 2013 (has links)
The ATLAS pixel detector will be upgraded with a new Insertable B-layer (IBL). The IBL will be inserted between the existing pixel detector and the reduced diameter vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have required the development of new radiation hard pixel sensor technologies and a new front end chip.3D-silicon sensors will populate 25% of the IBL sensing area. They are a newgeneration of micro-machined sensors with electrodes etched inside the silicon bulk rather than on the wafer surface. 3D-silicon sensors were studied by performing simulations, laboratory measurements and beam tests on irradiated and not irradiated samples.This thesis describes the development of a fast algorithm of the signal response in 3D-silicon sensors using Geant4 simulations. The simulation of the signal response is compared to actual data from test-beam and radioactive source measurements. The setup for each of these measurements is also simulated in Geant4 using experience gained after working with the real setup.
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Monitoring Radiation Damage in the ATLAS Pixel DetectorSchorlemmer, André Lukas 09 July 2014 (has links)
No description available.
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