This paper proposes a multitier multilevel TSV diagnosis scheme for 3D ICs to achieve interconnect reliability and yield with targets of interconnect faults under stuck-at and open fault models. This scheme takes advantage of previous work of IEEE 1500 compatible interconnect test and diagnosis methods, and further develop a TSV detection and diagnosis method for 3D circuits. An interconnect diagnosis scheme based on the oscillation ring (OR) test methodology for 3D systems-on-chip (SOC) designs with heterogeneous cores is proposed. The large number of test rings in the SOC design, however, significantly complicates the interconnect diagnosis problem. In this paper, the diagnosability of an interconnect structure is first analyzed then a fast diagnosability checking algorithm and an efficient diagnosis ring generation algorithm are proposed. It is shown in this paper that the both vertical and horizontal ring generation algorithm achieves the maximum detectability for any interconnect.