The role of water and volatiles in the solar system is of critical interest in planetary science. Evidence for the past action of water or direct observation of water on a planetary body can indicate the potential to harbor life and is critical to human exploration of the solar system. We study two very different remote sensing techniques that address the issue of identifying water-related processes on the surface of other planetary bodies, and in particular, Mars. The first technique, combined thermal infrared and visible imaging, has been used extensively on Mars for determining the thermal inertia of surface materials. In the second part of this dissertation, we develop a technique that combines remote thermophysical and visible data sets with ground-based field investigations for the identification of sedimentary features at the surfaces of alluvial fans. Several methods for remotely identifying sedimentary features will be explored using thermal and visible images. We combine results from pre-existing ground-based studies with thermal images and ground-based field investigations to develop a robust technique to be used on a variety of alluvial fans. In the third part, we characterize the remote thermophysical and visible properties of specific classes of sedimentary features on alluvial fans using the technique developed in part two. The second remote sensing technique, neutron spectroscopy, has been used on many planetary spacecraft missions for the identification of hydrogen on planetary surfaces. The Dynamic Albedo of Neutrons (DAN) instrument on the upcoming Mars Science Laboratory rover mission represents a new type of neutron detector for planetary spacecraft, with the neutron detectors mounted to a rover on the Martian surface (as opposed to in orbit around the planetary body) and neutron counts that are binned by time, energy, and location (as opposed to just by energy and location). In chapter four, we model expected neutron energies and arrival times for geologic settings where water has altered the chemistry of the near surface using available geochemical data from the Mars Exploration Rovers (MER). Particle transport models are used to determine the sensitivity of neutron detection techniques to the variations in hydrogen abundance, hydrogen layering and chemical composition measured by MER.

Photon detectors based on single-crystalline materials are of great interest for high performance imaging applications due to their low noise and fast response. The major detector materials for sensing in the long-wavelength infrared (LWIR) band (8-14 µm) are currently HgCdTe (MCT) and AlGaAs/GaAs quantum wells (QW) used in intraband-based quantum-well infrared photodetectors (QWIPs). These either suffer from compositional variations that are detrimental to the system performance as in the case of MCT, or, have an efficient dark current generation mechanism that limits the operating temperature as for QWIPs. The need for increased on-wafer uniformity and elevated operating temperatures has resulted in the development of various alternative approaches, such as type-II strained-layer superlattice detectors (SLSs) and intraband quantum-dot infrared photodetectors (QDIPs). In this work, we mainly explore two self-assembled quantum-dot (QD) materials for use as the absorber material in photon detectors for the LWIR, with the aim to develop low-dark current devices that can allow for high operating temperatures and high manufacturability. The detection mechanism is here based on type-II interband transitions from bound hole states in the QDs to continuum states in the matrix material. Metal-organic vapor-phase epitaxy (MOVPE) was used to fabricate (Al)GaAs(Sb)/InAs and In(Ga)Sb/InAs QD structures for the development of an LWIR active material. A successive analysis of (Al)GaAs(Sb) QDs using absorption spectroscopy shows strong absorption in the range 6-12 µm interpreted to originate in intra-valence band transitions. Moreover, record-long photoluminescence (PL) wavelength up to 12 µm is demonstrated in InSb- and InGaSb QDs. Mesa-etched single-pixel photodiodes were fabricated in which photoresponse is demonstrated up to 8 µm at 230 K with 10 In0.5Ga0.5Sb QD layers as the active region. The photoresponse is observed to be strongly temperature-dependent which is explained by hole trapping in the QDs. In the current design, the photoresponse is thermally limited at typical LWIR sensor operating temperatures (60-120 K), which is detrimental to the imaging performance. This can potentially be resolved by selecting a matrix material with a smaller barrier for thermionic emission of photo-excited holes. If such an arrangement can be achieved, type-II interband InGaSb QD structures can turn out to be interesting as a high-operating-temperature sensor material for thermal imaging applications. / <p>QC 20130521</p>

The thesis investigates the temperature distribution in the chip of an infrared camera caused by its read out integrated circuit. The heat from the read out circuits can cause distortions to the thermal image. Knowing the temperature gradient caused by internal heating, it will later be possible to correct the image by implementing algorithms subtracting temperature contribution from the read out integrated circuit. The simulated temperature distribution shows a temperature gradient along the edges of the matrix of active bolometers. There are also three hot spots at both the left and right edge of the matrix, caused by heat from the chip temperaturesensors and I/O pads. Heat from the chip temperature sensors also causes an uneven temperature profile in the column of reference pixels, possibly causing imperfections in the image at the levels of the sensors. Simulations of bolometer row biasing are carried out to get information about how biasing affects temperatures in neighbouring rows. The simulations show some row-to-row interference, but the thermal model suffers from having biasing heat inserted directly onto the top surface of the chip, as opposed to having heat originate from the bolometers. To get better simulation results describing the row biasing, a thermal model of the bolometers needs to be included. The results indicate a very small temperature increase in the active pixel array, with temperatures not exceeding ten millikelvin. Through comparisons with another similar simulation of the chip, there is reason to believe the simulated temperature increase is a bit low. The other simulation cannot be used to draw any conclusions about the distribution of temperature. / Examensarbetet undersöker den temperaturdistribution som uppkommer i ett chip till en IR-kamera till följd av värmeutvecklingen i dess egna utläsningskretsar. Genom att ha information om temperaturdistributionen är det möjligt att längre fram i utvecklingsprocessen skapa algoritmer som subtraherar bort chippets interna värmetillskott från den termiska bilden. Den simulerade temperaturdistributionen visar att de största temperaturgradienterna uppkommer längs den aktiva pixelmatrisens sidor. Det är även möjligt att se tre varmare områden vid både den vänstra och högra sidan av matrisen skapade av värme från chippets temperatursensorer och I/O-kretsar. Värme från temperatursensorerna påverkar även temperaturen i kolumnen med referenspixlar, vilket kan ge upphov till avvikelser i den termiska bilden i höjd med dessa temperatursensorer. Simuleringar av radvis basering av bolometrar utförs för att få information om hur bolometerbiaseringen påverkar temperaturen i angränsade rader. Simuleringarna visar att det finns störningar mellan rader, men simuleringsmodellen lider av avsaknaden av en termisk bolometermodell och tvingas applicera värme direkt på chipytan istället för att låta värme utvecklas i bolometrarna. För bättre simuleringsresultat innefattande bolometerbiasering bör en termisk bolometermodell inkluderas i simuleringen. Resultaten visar på en mycket liten temperaturökning inom den värmekänsliga aktiva pixelmatrisen, med temperaturökningar inom detta område som inte överstiger tio millikelvin. Genom jämförelser med en liknande simulering av samma chip är det inte omöjligt att dra slutsatsen att temperaturökningen är något låg. Det går inte att dra några slutsatser om temperaturens distribution genom denna jämförelse av simuleringar.

The chip formation process in machining is accompanied by heat generation. The heat generated influences both the workpiece physical properties as well as the cutting tool. High temperatures accelerate tool wear and thermal softening which are not desirable because they alter the accuracy of the machined surface and tool life. Many studies have been done to lower the heat generated in cutting. A first approach is to use a cutting fluid but its effectiveness is limited by its ability to penetrate between the tool and the chip. A second approach is to remove the heat generated through a cooling cycle as in interrupted cutting. The idea is either to translate a wide tool to the side as it moves forward relative to the workpiece, which allows the dissipation throughout the body of the tool or to use a cutting edge in the form of a disk that rotates about its principal axis. The latter, known as a rotary tool, provides a rest period for the cutting edge, thus enabling the edge to be cooled and a continuously fresh portion of the edge to be engaged with the workpiece. The rotary tool can be either driven by an external power source or self-propelled. This thesis focuses on the self-propelled rotary tool (SPRT) process for machining of difficult-to-machine material such as bearing steels, where tool life is of particular concern. Since the cutting temperatures are known to influence tool life significantly, the first task in this investigation involved developing a model to analyze heat transfer and temperature distribution in the cutting tool during SPRT turning of the hardened 52100 steel (58 HRC). Both rotary and equivalent fixed tool processes are compared in terms of cutting tool temperatures generated. The model is based on the moving heat source theory of conduction and employs the Finite Element Method (FEM) for its solution. The model is experimentally verified through measurement of the cutting temperature distribution using an Infra-Red imaging camera under different cutting conditions. Predicted and measured temperatures show good overall agreement when they are measured along the cutting edge and measured temperatures are up to 50??ower in rotary tool cutting than in fixed tool cutting under the same conditions.

Quantum Well Infrared Photodetectors (QWIPs) are strong competitors to other detector technologies for future third generation thermal imagers. QWIPs have inherent advantages of mature III-V material system and well settled fabrication technology, as well as narrow band photo-response which is an important property facilitating the development of dual-band imagers with low crosstalk. This thesis focuses on the development of long/mid wavelength dual band QWIP focal plane arrays (FPAs) based on the AlGaAs/GaAs material system. Apart from traditional single band QWIPs, the dual-band operation is achieved by proper design of a bias tunable quantum well structure which has two responsivity peaks at 4.8 and 8.4 um for midwave infrared (MWIR) and longwave infrared (LWIR) atmospheric windows, respectively. The fabricated large format (640x512) FPA has MWIR and LWIR cut-off wavelengths of 5.1 and 8.9 um, and it provides noise equivalent temperature differences (NETDs) of ~ 20 and 32 mK (f/1.5 at 65 K) in these bands, respectively. The employed bias tuning approach for the dual-band operation requires the same fabrication steps established for single band QWIP FPAs, which is an important advantage of the selected method resulting in high-yield, high-uniformity and low-cost. Results are encouraging for fabrication of low cost, large format, and high performance dual band FPAs, making QWIP a stronger candidate in the competition for third generation thermal imagers

Στην παρούσα εργασία εξετάζεται η αύξηση της ανάλυσης (super resolution) σε θερμικές εικόνες χρησιμοποιώντας τεχνικές συμπιεσμένης καταγραφής (compressed sensing). Οι εικόνες εκφράζονται με αραιό τρόπο ως προς δυο υπερπλήρη λεξικά (ένα χαμηλής και ένα υψηλής ανάλυσης) και επιχειρούμε κατασκευή της εικόνας υψηλής ανάλυσης. Τα αποτελέσματα της μεθόδου αυτής συγκρίνονται με τα αποτελέσματα τεχνικών που χρησιμοποιούν image registration με ακρίβεια subpixel για την επίτευξη του super resolution. / This thesis deals with the problem of resolution enhancement (super resolution) of thermal images using com- pressed sensing methods. We solve the super resolution problem in four stages. First, we seek a sparse representation of a low-resolution image with respect to two statistically-learned overcomplete dictionaries (for high and low resolution images respectively) and then we use the coefficients of this representa- tion to calculate the high resolution image. Then, we calculate the high resolution image using methods requiring multiple low resolution images aligned with subpixel accuracy (conventional approach). We compare the results of each method using broadly acclaimed metrics regarding reconstruction quality standards.

This thesis presents a comprehensive study on the thermal modelling aspects of laser transmission welding of thermoplastics (LTW), a technology for joining of plastic parts. In the LTW technique, a laser beam passes through the laser-transmitting part and is absorbed within a thin layer in the laser-absorbing part. The heat generated at the interface of the two parts melts a thin layer of the plastic and, with applying appropriate clamping pressure, joining occurs. Transient thermal models for the LTW process were developed and solved by the finite element method (FEM). Input to the models included temperature-dependent thermo-physical properties that were adopted from well-known sources, material suppliers, or obtained by conducting experiments. In addition, experimental and theoretical studies were conducted to estimate the optical properties of the materials such as the absorption coefficient of the laser-absorbing part and light scattering by the laser-transmitting part. Lap-joint geometry was modelled for semi crystalline (polyamide - PA6) and amorphous (polycarbonate - PC) materials. The thermal models addressed the heating and cooling stages in a laser welding process with a stationary and moving laser beam. An automated ANSYS® script and MATLAB® codes made it possible to input a three-dimensional (3D), time-varying volumetric heat-generation term to model the absorption of a moving diode-laser beam. The result was a 3D time-transient, model of the laser transmission welding process implemented in the ANSYS® FEM environment. In the thermal imaging experiments, a stationary or moving laser beam was located in the proximity of the side surface of the two parts being joined in a lap-joint configuration. The side surface was then observed by the thermal imaging camera. For the case of the stationary beam, the laser was activated for 10 s while operating at a low power setting. For the case of the moving beam, the beam was translated parallel to the surface observed by the camera. The temperature distribution of a lap joint geometry exposed to a stationary and moving diode-laser beam, obtained from 3D thermal modelling was then compared with the thermal imaging observations. The predicted temperature distribution on the surface of the laser-absorbing part observed by the thermal camera agreed within 3C with that of the experimental results. Predicted temperatures on the laser-transmitting part surface were generally higher by 15C to 20C. This was attributed to absorption coefficient being set too high in the model for this part. Thermal imaging of the soot-coated laser-transmitting part surface indicated that significantly more scattering and less absorption takes place in this part than originally assumed. For the moving laser beam, good model match with the experiments (peak temperatures predicted within 1C) was obtained for some of the process conditions modelled for PA6 parts. In addition, a novel methodology was developed to extract the scattered laser beam power distribution from the thermal imaging observations of the moving laser beam. / Thesis (Ph.D, Mechanical and Materials Engineering) -- Queen's University, 2008-10-08 10:39:30.952

Thermal imaging is a non-invasive and marker-free approach for intraoperative measurements of small temperature variations. In this work, we demonstrate the abilities of active dynamic thermal imaging for analysis of tissue perfusion state in case of cerebral ischemia. For this purpose, a NaCl irrigation is applied to the exposed cortex during hemicraniectomy. The cortical temperature changes are measured by a thermal imaging system and the thermal signal is recognized by a novel machine learning framework. Subsequent tissue heating is then approximated by a double exponential function to estimate tissue temperature decay constants. These constants allow us to characterize tissue with respect to its dynamic thermal properties. Using a Gaussian mixture model we show the correlation of these estimated parameters with infarct demarcations of post-operative CT. This novel scheme yields a standardized representation of cortical thermodynamic properties and might guide further research regarding specific intraoperative diagnostics.

Printed electronics is a combination of electronics and printing technologies commonly used in the publication industry such as screen, inkjet, and roll to roll printing. The measurements of conductive film particularly the conductive paste is the main objective of this thesis. The conductive paste consists of conductive filler, adhesive and solvent. Each component affects the electrical, and mechanical properties of the finished conductive film product. The measurements of conductive film have three field of study. The first category is the lifetime performance measurement of conductive film using environmental testing. A screen printed carbon, silver and a developmental paste were categorised to environmental testing and third harmonic measurement. The second category is the measurement AC Impedance and DC resistance of conductive ink during cure. During the curing of the pastes, the AC impedance and DC resistance were monitored. A LabVIEW program was developed to control the AC impedance analyser, DC resistance ohmmeter, and convection oven. Samples were measured whilst curing at different curing temperatures and for a range of particle loadings. Particle loading is the percentage of conductive filler against the rest of the chemical in the conductive paste. The last category was defect detection using the combination of electromechanical testing, a Scanning Electron Microscope (SEM) and an Infrared (IR) imaging technique. Printed carbon and silver were mechanically aged by bending the printed structure up to 100 k times. The results from the lifetime performance measurements on carbon, silver and the developmental paste showed the polymer resin behaviour in high humidity and high temperature environments. The increased oxidation rate due to the elevated temperatures affected the conductive particle of certain pastes. The third harmonic testing technique was able to detect failures on conductive film in the form of width reduction. The AC impedance measurement technique could indicate the final resistivity value. The AC impedance measurement was affected by the test frequency used while the ink is in liquid state. Correct test frequency setting will have less noise and less impedance value, vital in predicting the final cured resistance of the printed paste. The curing temperature affects the final cured resistance value while the particle loading affects the rate of curing of conductive film. The electrical measurement on mechanically aged samples showed that the carbon prints have its resistance readings below its initial value while the silver prints resistance increased. SEM images shows that the carbon print indicates no visual damage on the surface after 100 k bent cycle, while physical defects were observed in silver prints. The infrared measurements on carbon prints showed an increase in temperature while developments of heat patches were observed on silver prints. Difference in emissivity values of materials used provided the contrast effect which plays an important role in detecting defect using infrared imaging technique because. Third harmonic application to the printed electronics is new to this field. Normally, testing is done using environmental testing to determine the lifetime performance of the conductive film. This is effective however requires a lot of time and effort to produce a result. AC Impedance is used widely and the application can be seen on cured printed electronics. The application and measurement of AC impedance during cure and DC resistance measurement has indicated initial resistivity values. The measurement has further the effect of using AC impedance on different curing temperature and particle loading. The phase measurement as well has brought insight of degree of curing. The application of infra-red imaging technique to the mechanically aged device has produced a result that DC resistance and SEM imaging failed to detect. Normally DC resistance measurement was used as quality assessment tool but test shows on mechanically aged product failed to detect increase in resistance due to mechanical aging techqnique.

L'objectif de cette thèse était de développer de nouvelles méthodes micro- et nano-thermométriques proposant de hautes résolutions spatiales et temporelles. Dans ce cadre nous nous sommes concentrés sur deux tâches : dans un premier temps, nous avons développé un dispositif de nano-chauffage qui peut aisément servir à la caractérisation thermo-physique de matériaux à l'échelle nanométrique. Dans un second temps, en utilisant cette plate-forme nous avons étudié des matériaux thermosensibles, incluant divers luminophores et des complexes à transition de spin ainsi que leurs mélanges. Les dispositifs de nano-chauffage, basés sur des nanofils chauffés par effet Joule, ont été fabriqués par lithographie électronique conventionnelle. Grâce à leur faible inertie thermique, les dispositifs basés sur des nanofils sont particulièrement intéressants en termes de temps de réponse et de confinement des changements de température induits. La caractérisation thermique de ces éléments de chauffage a été réalisée à l'aide de méthodes électriques et optiques ainsi que de simulations par éléments finis. Nous avons montré expérimentalement que nos chauffages prodiguent des perturbations en température (1 K < DeltaT < 80 K) rapides (< µs) et spatialement localisées (< µm) lorsque stimulées par des impulsions de courant électrique. Les simulations par éléments finis reproduisent ces résultats expérimentaux avec une bonne précision et prouvent ainsi leur intérêt pour le design de tels dispositifs. Les performances thermométriques de matériaux fluorescents, incluant des colorants organiques (Rhodamine B), des nanoparticules inorganiques (PbF2:Er3+/Yb3+, CdSe) et des nanoparticules hybrides organiques/inorganiques ([Fe(Htrz)2(trz)]BF4@SiO2-pyrene), ont ensuite été étudiées. D'une manière générale, leur intérêt pour l'imagerie thermique a été démontré, mais des problèmes de stabilité rendent les mesures quantitatives difficiles avec de tels matériaux. D'un autre côté, nous avons réussi à synthétiser des films de nanoparticules du complexe à transition de spin [Fe(Htrz)2(trz)]BF4 (non-dopé). Ces films qui nous ont permis de suivre les changements de température à l'aide de mesures de réflectivité optique plus robustes. La boucle d'hystérèse thermique dans ce matériau procure un effet de mémoire thermique à long terme dont nous avons usé avec succès pour imager les changements de température très rapides (< µs) et spatialement localisés (< µm) - même après que la chaleur se soit dissipée. Cette méthode originale nous procure une combinaison sans précédent de sensitivité spatio-temporelle dans le champ de la nano-thermométrie aux applications pratiques prometteuses. / The overall objective of this PhD thesis was to develop novel micro- and nano-thermometry methods providing high spatial and temporal resolution thermal imaging. To achieve this goal we have focused on two tasks: First, we developed a nano-heater device that can be easily employed for the thermo-physical characterization of materials at the nanoscale. In a second time, using this platform we investigated thermo-sensitive materials, including different luminophores and spin crossover complexes as well as their mixtures. The nano-heater device, based on Joule-heated metallic nanowires, was fabricated by standard electron beam lithography. Due to their small thermal mass, nanowire based devices are particularly interesting in terms of response times and also in terms of confinement of the induced temperature changes. The thermal characterization of these heating elements was carried out using electrical and optical methods as well as finite element simulations. We have shown experimentally that our heaters can provide fast (< µs) and spatially well localized (< µm) T-jump perturbations (1 K < DeltaT < 80 K) driven by an electrical current pulse. Finite element simulations reproduced these experimental results with good accuracy and proved to be a powerful tool of prediction for the device design. Fluorescent materials, including organic dyes (Rhodamine B), inorganic nanoparticles (PbF2:Er3+/Yb3+, CdSe) and hybrid organic/inorganic nanoparticles ([Fe(Htrz)2(trz)]BF4@SiO2-pyrene), were then investigated for their thermometry performance. Overall, they were found useful for thermal imaging, but stability problems make quantitative measurements challenging with these materials. On the other hand, we have succeeded in synthesizing nanoparticle films of the (undoped) [Fe(Htrz)2(trz)]BF4 spin crossover complex, which allowed us to infer temperature changes through more robust optical reflectivity measurements. The thermal hysteresis loop in this material provides a long-term thermal memory effect which we used successfully to image very fast (˜µs) transient temperature changes with high spatial resolution (sub-µm) - even when the heat is dissipated. This original method provides an unprecedented combination of spatio-temporal sensitivity within the field of nanothermometry with promising potential applications.