The potential failure in through-silicon vias (TSVs) still poses a challenge in trying to extend the useful life of a 3D integrated circuit (IC). A model is proposed to mitigate the communication problem in 3D integrated circuits caused by the breaks at the TSVs. We provide the details of a low-complexity network that takes advantages of redundant TSVs to make it possible to re-route around breaks and maintain effective communication between layers. Different configurations for the micronetwork are analyzed and discussed. We also present an evaluation of the micronetwork's performance, which turns out to be quite promising, based on several Monte Carlo simulations. Finally, we provide some directions for future research on the subject.

Many studies have focused on the effects of MNC subsidiaries' external relational embeddedness. Little attention has been given to its antecedents and especially to the potential effect that the business network context might have. We try to fill this gap and attempt to explain variation among subsidiaries' degree of relational embeddedness. Our results show a strong and robust effect of the business network context -- i.e. the network context in which the direct business relationships between the subsidiary and its partners are embedded -- on the degree of relational embeddedness. However, contrary to previous literature, we find an inverted u-shaped relationship. We discuss our findings with regard to the issue of over-embeddedness and the literature on the strength of weak versus strong ties.