Thesis (M.S.)--State University of New York at Binghamton, Materials Science and Engineering Program, 2008. / Includes bibliographical references.

Thesis (Ph.D.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Sitaraman, Suresh.

Thesis--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.181-188).

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references (leaves 85-90). Also available in electronic version.

Thesis (M.Sc.)--City University of Hong Kong, 2005. / At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, 2005. / Includes bibliographical references.

Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.

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<p dir="ltr">Electronics have contributed to the advancement of healthcare, wellness, security, and mobility, resulting in a higher standard of living. However, these ever-accelerating advancements and widespread application come at the cost of a shortened product life cycle and increase in produced E-waste which poses a significant environmental challenge. Recycling E-waste is challenging due to the complexity of electronics and packaging, hindering component retrieval for reuse. While sustainable materials for electronics have been researched, sustainable integrated circuit (IC) packaging for conventional electronics remains unexplored. This study introduces a method involving dissolvable additively manufactured packaging materials to recover commercial-off-the-shelf (COTS) chips from used electronics, which would alleviate supply-chain stress, reduce the need for manufacturing similar chips, and minimize environmental impact. In this work, Polyvinyl alcohol (PVA) and Acrylonitrile butadiene styrene (ABS), are explored as potential dissolvable semiconductor packaging materials. Optimal dissolving conditions allow chip recovery in less than 11 minutes for PVA and 2 minutes for ABS. This approach offers a sustainable packaging method for commercial electronic chips that matches conventional packaging performance with the added functionality of recoverable and recyclable components, contributing to the gap in sustainability and recycling for conventional electronics.</p>

The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of filler particles, such as size, shape and distribution, on electrical conductivity are studied by the method of factorial design. The second part of the dissertation evaluates the reliability and investigates the failure mechanism of conductive adhesives subjected to fatigue loading, moisture conditioning and drop impacts. In fatigue tests it is found that electrical conduction failure occurs prior to mechanical failure. The experimental data show that electrical fatigue life can be described well by the power law equation. The electrical failure of conductive adhesives in fatigue is due to the impaired epoxy-silver interfacial adhesion. Moisture uptake in conductive adhesives is measured after moisture conditioning and moisture recovery. The fatigue life of conductive adhesives is significantly shortened after moisture conditioning and moisture recovery. The moisture accelerates the debonding of silver flakes from epoxy resin, which results in a reduced fatigue life. Drop tests are performed on test vehicles with conductive adhesive joints. The electrical conduction failure happens at the same time as joint breakage. The drop failure life is found to be correlated with the strain energy caused by the drop impact, and a power law life model is proposed for drop tests. The fracture is found to be interfacial between the conductive adhesive joints and components/substrates. This research provides a comprehensive understanding of the conduction mechanism of conductive adhesives. The computer-simulated modeling approach presents a useful design tool for the conductive adhesive industry. The reliability tests and proposed failure mechanisms are helpful to prevent failure of conductive adhesives in electronic packages. Moreover, the fatigue and impact life models provide tools in product design and failure prediction of conductive adhesives.