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Investigation of distributed circuit theory with retardation for analysis of microwave characteristics of three dimensional conductor/dielectric structures /Tatikola, Ramani, January 1999 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 142-149).
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Improvement in Adhesion for the Epoxy-SiC System via Plasma and Silane Surface Modification TechniquesNeyman, Elizabeth 21 August 2003 (has links)
The adhesion durability of coatings and encapsulant materials utilized in electronic packaging is vital for device reliability in the microelectronics industry. Due to adverse operating conditions such as high moisture and high temperature environments, the adhesion between an adhesive and its substrate is typically compromised. This thesis addresses the advantages of employing plasma pretreatments and surface derivatization using silane coupling agents as surface modification techniques in an effort to enhance the adhesive bonding of epoxy to SiC coated Si wafers (SiC/Si). Durability was evaluated by immersing coated-Si samples in aqueous solutions at elevated temperature (60°C) to simulate prolonged severe operating conditions.
Three surface modification approaches for the SiC/Si substrate to be discussed include: 1) a silane coupling agent treatment, which involves a reaction of either 3-aminopropyltriethoxysilane (APS) or 3-glycidoxypropyltrimethoxysilane (GPS) with the substrate, 2) an oxygen plasma pretreatment followed by a silane treatment, and 3) a water/oxygen plasma pretreatment followed by a silane treatment. Samples were immersed in aqueous solutions at various pH at 60°C for extended periods of time. Adhesion durability of treated epoxy/SiC/Si systems was qualitatively evaluated by visual inspection for debonding, and quantitatively evaluated using a probe test to evaluate the critical strain energy release rate G<sub>c</sub>. Additionally, X-ray photoelectron spectroscopy (XPS) surface characterization was carried out following the surface treatments and again after complete failure in the durability tests.
The durability tests illustrated that surface treatments involving an oxygen plasma pretreatment prior to silane derivatization resulted in significant improvement in adhesive performance. Furthermore, the results of XPS analysis suggested that the improved bonding was due to cleaning of the substrate surface, promotion of silane adsorption and the formation of a thicker oxide layer. The effectiveness of the surface modification methods in relationship to surface chemistry and adhesion for the epoxy/SiC/Si system is reported and discussed in this work. / Master of Science
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Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packagingLi, Haiying 01 December 2003 (has links)
No description available.
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Run-to-run control of overlay and linewidth in semiconductor manufacturingBode, Christopher Allen, January 2001 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2001. / Vita. Includes bibliographical references (leaves 164-176). Available also in a digital version from Dissertation Abstracts.
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Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packagingLi, Haiying, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Textile and Fiber Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Vita. Includes bibliographical references (leaves 197-210).
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Study on the curing process of no-flow and wafer level underfill for flip-chip applicationsZhang, Zhuqing, January 2003 (has links) (PDF)
Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).
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Processing of NITI reinforced adaptive solder for electronic packaging /Wright, William L. January 2004 (has links) (PDF)
Thesis (M.S. in Mechanical Engineering)--Naval Postgraduate School, March 2004. / Thesis advisor(s): Indranath Dutta. Includes bibliographical references (p. 45-47). Also available online.
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Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structuresWang, Guotao 28 August 2008 (has links)
Not available / text
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Wideband characterization of wire bond interconnects for microwave integrated circuit packagingSutono, Albert 05 1900 (has links)
No description available.
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Development of multi-layer on-package microwave balunsObatoyinbo, Ade 08 1900 (has links)
No description available.
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