Critical currents in the latest biaxially textured 'coated conductors' are now limited by 2D networks of low angle grain boundaries (LAGBs) with misorientation θm = 1 - 10°. In order to understand and optimise current transfer in these materials it is essential to elucidate the electromagnetic behaviour of the LAGB. This work presents an investigation into the transport properties of [001]-tilt LAGBs formed by the thin film deposition of YBa2Cu3O7 onto bicrystalline substrates. Through the use of a precision two-axis goniometer, measurements of the V-I characteristic and critical current density were made as magnetic field was rotated in angles θ and φ relative to the LAGB defect. It is found that for fields applied parallel to the LAGB defect plane, dissipation is dominated by the viscous flux flow of vortices along the boundary. Clear evidence for this is found in the V-I characteristic, which displays an increased linearity indicative of the viscous regime. It is shown that the number of vortex rows involved in the flow process can discontinuously switch, leading to a V-I characteristic made up of straight segments of different gradient. For fields applied away from the LAGB defect plane a kinked vortex structure develops and the boundary critical current density, JcGB, is determined by the channelling of vortex segments still lying within the LAGB. The channelling regime is seen in angular measurements as a marked decrease in JcGB(θ,φ) as field becomes aligned to within critical angles φK or θK of the LAGB. The aligned vortices experience a reduction in dimensionality that is manifest in a reduced temperature dependence of JcGB(T). For fields applied at a sufficiently large angle from the defect plane the deleterious effects of the LAGB on current transport are mitigated considerably. In this regime a collinear vortex structure is regained and transport is controlled by the intragranular (IG) sections of the LAGB track; JcGB = δJcIG where δ ~ 0.8, a result that is independent of field, temperature and angle for a 4.9° LAGB. For rotation of the applied field within the LAGB defect plane, the presence of a pinning peak in JcGB for field aligned to the dislocation array is confirmed and modelled. The peak is found to be absent in IG track measurements and increases relative to the intrinsic peak with both increasing field and temperature. In addition, a pronounced angular hysteresis is presented, which is directly linked to a corresponding 'static' hysteresis in JcGB(B) with field. Magneto-optic measurements confirm that this effect is controlled by the flux density profile in the IG regions of the LAGB track. Finally, above a temperature, angle and sample dependent merging field, B*, the LAGB is found to be effectively transparent, as δ ~ 1. This is due to the irreversibility line, above which dissipation occurs across the whole LAGB track.

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Typescript (photocopy). / Digitized by Kansas Correctional Industries

β – Tricalcium phosphate (β-TCP, Ca3(PO4)2) is a commonly used bone substitute material due to its biocompatibility and resorption. This study focused on the production of almost fully dense β-TCP ceramics with varying degrees of impurities (Ca/PO4 ratio, addition of 5% Mg). Three methods were used to produce the β-TCP ceramics, uniaxial pressing, slip-casting and isostatic pressing. In this study the isostatic pressing and sintering at 1150ºC for 20h and 15min, resulted in the densest β-TCP ceramics (97.7-99.2%). No significant differences of grain size and density could be detected between the samples produced with various compositions. These isostatically pressed samples sintered at 1150ºC were then dissolved in 0.08M aceticacid solution to simulate the in vivo resorption. It was found that the samples containing extra Mg dissolved slower. Attempts to determine the chemical composition of the grain boundaries were made without success. However, SEM observations of partly dissolved β-TCP ceramics revealed that the grain boundaries dissolved faster than the grains. The study was performed at the RMS foundation in Switzerland.

Thesis (Ph. D.)--Lehigh University, 2000. / Includes bibliographical references and vita.

The scaling required to accommodate faster chip performance in microelectronic devices has necessitated a reduction in the dimensions of copper interconnects at the back end of the line. The constant downscaling of copper interconnects has resulted in changes to the microstructure, and these variations are known to impact electrical resistivity and reliability issues in interconnects. In this work, a novel electron diffraction technique called Diffraction Scanning Transmission Electron Microscopy (D-STEM) has been developed and coupled with precession electron microscopy to obtain quantitative local texture information in damascene copper lines (1.8 \mu m to 70 nm in width) with a spatial resolution of less than 5 nm. Misorientation and trace analysis has been performed to investigate the the grain boundary distribution in these lines. The results reveal strong variations in texture and grain boundary distribution of the copper lines upon downscaling. 1.8 \mu m wide lines exhibit strong <111> normal texture and comprise large bamboo-type grains. Upon downscaling to 180 nm, a {111} <110> biaxial texture has been observed. In contrast, narrower lines of widths 120 nm and 70 nm reveal sidewall growth of {111} grains and a dominant <110> normal texture. The fraction of coherent twin boundaries also reduces with decreasing line width. The microstructure changes from bamboo-type in wider lines to one comprising clusters of small grains separated by high angle boundaries in the vicinity of large grains. The evolution of such a microstructure has been discussed in terms of overall energy minimization and dimensional constraints. Finite element analysis has been performed to correlate misorientations between grains and local thermal stresses associated with stress migration. Effect of variations in the copper interconnect microstructure on electromigration flux divergence has also been discussed. / text

Thesis (Ph.D.) -- McMaster University, 2002. / Includes bibliographical references (leaves 168-178). Also available via World Wide Web.