This dissertation presents a comparative study about the performance of silicon (Si) and gallium nitride (GaN) semiconductors in drivers for light emitting diodes. Hereby, it is expected to provide the theoretical background required for the development of future works using this new technology. Theoretical aspects related to the materials used in the manufacture of semiconductors and their implications in the final product, as well as the characteristics and peculiarities of GaN semiconductors are presented. The experimental development consisted of two case studies, each focused on a distinct topology with different types of GaN semiconductors. First, a comparison of Si and enhancement mode GaN transistors was carried out in a family of synchronous buck converters. Ten 48 V to 28.3 V and 22.6 W converters were designed with the same parameters, at five different switching frequencies, ranging from 100 kHz to 1 MHz. Efficiency and temperatures were measured in four different scenarios: with and without an external diode in parallel with the low-side switch and with two different dead-time values, 25 ns and 50 ns. Converters with GaN transistors showed higher efficiency and lower temperatures in all cases, with a maximum efficiency of 96.8% and a minimum of 94.5%. In addition, Si-based converters exhibited greater performance degradation as the switching frequency and dead time increased. In the second study, nine 75 W off-line integrated double buck-boost converters were developed and evaluated. Two different Si technologies were compared with a cascode GaN transistor at three switching frequencies, ranging from 50 to 150 kHz. Again, the efficiency and temperatures of the prototypes were measured. The converters with GaN demonstrated superior performance in all cases, yielding about 5% gain in efficiency over the worst tested Si semiconductor. In both cases, the converters’ loss distribution was presented based on simulation results. It was concluded that the gallium nitride transistors have the potential to replace silicon technology mainly due to its superior performance and requirement of small, or no change, in the original circuit. / A presente dissertação apresenta um estudo comparativo do desempenho de semicondutores de silício (Si) e nitreto de gálio (GaN) em circuitos utilizados na alimentação de diodos emissores de luz. Por meio deste, procura-se fornecer o embasamento teórico necessário para o desenvolvimento de trabalhos futuros utilizando esta nova tecnologia. São apresentados, inicialmente, aspectos teóricos relacionados aos materiais utilizados na fabricação de semicondutores e suas implicações no produto final, além das características e peculiaridades dos semicondutores GaN. O desenvolvimento experimental consistiu de dois estudos de caso, cada um focado em uma topologia distinta com tipos de semicondutores GaN diferentes. Primeiramente, realizou-se um comparativo de transistores Si e GaN do tipo intensificação em uma família de conversores buck síncronos. Dez conversores 48 V para 28,3 V e 22,6 W foram projetados, com os mesmos parâmetros, em cinco diferentes frequências de comutação, variando de 100 kHz a 1 MHz. Eficiência e temperaturas foram medidas em quatro diferentes cenários: com e sem um diodo externo em paralelo com o interruptor de roda-livre e com dois valores diferentes de tempo morto, 25 ns e 50 ns. Os conversores com transistores GaN apresentaram maior eficiência e menores temperaturas em todos os casos, com uma eficiência máxima de 96,8% e uma mínima de 94,5%. Além disso, os conversores com Si exibiram uma maior degradação de desempenho à medida que a frequência de comutação e o tempo morto aumentam. No segundo estudo, nove conversores duplo buck-boost integrados de 75 W com alimentação a partir da rede elétrica foram desenvolvidos e avaliados. Compararam-se duas tecnologias distintas de interruptores de Si com um transistor GaN do tipo cascode, em três frequências de comutação, variando de 50 a 150 kHz. Novamente, mediu-se a eficiência e temperaturas dos protótipos. Os conversores com GaN demonstraram desempenho superior em todos os casos, com um ganho de cerca de 5% no rendimento em relação ao pior semicondutor Si testado. Em ambos os estudos de caso, a distribuição de perdas dos conversores foi apresentada com base em resultados de simulação. Concluiu-se que os transistores de nitreto de gálio têm potencial para substituir a tecnologia de silício utilizada atualmente devido, principalmente, a seu desempenho superior e exigência de pouca, ou nenhuma, mudança no circuito original.

abstract: The drive towards device scaling and large output power in millimeter and sub-millimeter wave power amplifiers results in a highly non-linear, out-of-equilibrium charge transport regime. Particle-based Full Band Monte Carlo device simulators allow an accurate description of this carrier dynamics at the nanoscale. This work initially compares GaN high electron mobility transistors (HEMTs) based on the established Ga-face technology and the emerging N-face technology, through a modeling approach that allows a fair comparison, indicating that the N-face devices exhibit improved performance with respect to Ga-face ones due to the natural back-barrier confinement that mitigates short-channel-effects. An investigation is then carried out on the minimum aspect ratio (i.e. gate length to gate-to-channel-distance ratio) that limits short channel effects in ultra-scaled GaN and InP HEMTs, indicating that this value in GaN devices is 15 while in InP devices is 7.5. This difference is believed to be related to the different dielectric properties of the two materials, and the corresponding different electric field distributions. The dielectric effects of the passivation layer in millimeter-wave, high-power GaN HEMTs are also investigated, finding that the effective gate length is increased by fringing capacitances, enhanced by the dielectrics in regions adjacent to the gate for layers thicker than 5 nm, strongly affecting the frequency performance of deep sub-micron devices. Lastly, efficient Full Band Monte Carlo particle-based device simulations of the large-signal performance of mm-wave transistor power amplifiers with high-Q matching networks are reported for the first time. In particular, a CellularMonte Carlo (CMC) code is self-consistently coupled with a Harmonic Balance (HB) frequency domain circuit solver. Due to the iterative nature of the HB algorithm, this simulation approach is possible only due to the computational efficiency of the CMC, which uses pre-computed scattering tables. On the other hand, HB allows the direct simulation of the steady-state behavior of circuits with long transient time. This work provides an accurate and efficient tool for the device early-stage design, which allows a computerbased performance evaluation in lieu of the extremely time-consuming and expensive iterations of prototyping and experimental large-signal characterization. / Dissertation/Thesis / Ph.D. Electrical Engineering 2011

abstract: In this work, the insight provided by our sophisticated Full Band Monte Carlo simulator is used to analyze the behavior of state-of-art devices like GaN High Electron Mobility Transistors and Hot Electron Transistors. Chapter 1 is dedicated to the description of the simulation tool used to obtain the results shown in this work. Moreover, a separate section is dedicated the set up of a procedure to validate to the tunneling algorithm recently implemented in the simulator. Chapter 2 introduces High Electron Mobility Transistors (HEMTs), state-of-art devices characterized by highly non linear transport phenomena that require the use of advanced simulation methods. The techniques for device modeling are described applied to a recent GaN-HEMT, and they are validated with experimental measurements. The main techniques characterization techniques are also described, including the original contribution provided by this work. Chapter 3 focuses on a popular technique to enhance HEMTs performance: the down-scaling of the device dimensions. In particular, this chapter is dedicated to lateral scaling and the calculation of a limiting cutoff frequency for a device of vanishing length. Finally, Chapter 4 and Chapter 5 describe the modeling of Hot Electron Transistors (HETs). The simulation approach is validated by matching the current characteristics with the experimental one before variations of the layouts are proposed to increase the current gain to values suitable for amplification. The frequency response of these layouts is calculated, and modeled by a small signal circuit. For this purpose, a method to directly calculate the capacitance is developed which provides a graphical picture of the capacitative phenomena that limit the frequency response in devices. In Chapter 5 the properties of the hot electrons are investigated for different injection energies, which are obtained by changing the layout of the emitter barrier. Moreover, the large signal characterization of the HET is shown for different layouts, where the collector barrier was scaled. / Dissertation/Thesis / Doctoral Dissertation Electrical Engineering 2016

abstract: With the high demand for faster and smaller wireless communication devices, manufacturers have been pushed to explore new materials for smaller and faster transistors. One promising class of transistors is high electron mobility transistors (HEMT). AlGaAs/GaAs HEMTs have been shown to perform well at high power and high frequencies. However, AlGaN/GaN HEMTs have been gaining more attention recently due to their comparatively higher power densities and better high frequency performance. Nevertheless, these devices have experienced truncated lifetimes. It is assumed that reducing defect densities in these materials will enable a more direct study of the failure mechanisms in these devices. In this work we present studies done to reduce interfacial oxygen at N-polar GaN/GaN interfaces, growth conditions for InAlN barrier layer, and microanalysis of a partial InAlN-based HEMT. Additionally, the depth of oxidation of an InAlN layer on a gate-less InAlN/GaN metal oxide semiconductor HEMT (MOSHEMT) was investigated. Measurements of electric fields in AlGaN/GaN HEMTs with and without field plates are also presented. / Dissertation/Thesis / Doctoral Dissertation Physics 2018

abstract: This work is focused on modeling the reliability concerns in GaN HEMT technology. The two main reliability concerns in GaN HEMTs are electromechanical coupling and current collapse. A theoretical model was developed to model the piezoelectric polarization charge dependence on the applied gate voltage. As the sheet electron density in the channel increases, the influence of electromechanical coupling reduces as the electric field in the comprising layers reduces. A Monte Carlo device simulator that implements the theoretical model was developed to model the transport in GaN HEMTs. It is observed that with the coupled formulation, the drain current degradation in the device varies from 2%-18% depending on the gate voltage. Degradation reduces with the increase in the gate voltage due to the increase in the electron gas density in the channel. The output and transfer characteristics match very well with the experimental data. An electro-thermal device simulator was developed coupling the Monte Caro-Poisson solver with the energy balance solver for acoustic and optical phonons. An output current degradation of around 2-3 % at a drain voltage of 5V due to self-heating was observed. It was also observed that the electrostatics near the gate to drain region of the device changes due to the hot spot created in the device from self heating. This produces an electric field in the direction of accelerating the electrons from the channel to surface states. This will aid to the current collapse phenomenon in the device. Thus, the electric field in the gate to drain region is very critical for reliable performance of the device. Simulations emulating the charging of the surface states were also performed and matched well with experimental data. Methods to improve the reliability performance of the device were also investigated in this work. A shield electrode biased at source potential was used to reduce the electric field in the gate to drain extension region. The hot spot position was moved away from the critical gate to drain region towards the drain as the shield electrode length and dielectric thickness were being altered. / Dissertation/Thesis / Ph.D. Electrical Engineering 2013

No description available.

Electrical equivalent circuit modeling of active components is one of the most important approaches for modeling high-frequency high-power devices. Amongst the most used microwave devices, AlGaN/GaN HEMTs demonstrated their superior performance, making them highly suitable for 5G, wireless and satellite communications. Despite the remarkable performance of AlGaN/GaN HEMTs, these devices reside on substrates that invoke limitations on the operating-frequency, power-efficiency, and current dispersion phenomenon. Also, there is a limitation in present parameters extraction techniques being not able to consider both the substrate effect (Silicon, Silicon Carbide, and Diamond) and the asymmetrical GaN HEMT structure. In this thesis work, a single extrinsic parameters extraction technique using a single small-signal topology takes into account both the asymmetrical GaN HEMT structure and the different substrate types with their parasitic conduction will be developed and studied for the first time. Moreover, large-signal modeling using Quasi-Physical Zone Division technique has been applied to both GaN/D and GaN/SiC to model the isothermal-trapping free drain current, and combined with a new simple technique for comparing performance between active devices in terms of current-dispersion. The models were verified by simulating the small-signal S-parameters, large-signal IV characteristics, and single-tone load-pull. High accuracy was achieved compared to the measurement data available in the technical literature and obtained from fabricated devices.

Les semi-conducteurs III-V à base d’azote et leurs alliages possèdent des propriétés remarquables et sont largement étudiés depuis les années 90. En comparaison à d'autres semi-conducteurs III-V, Les alliages de type ; AlGaN, InGaN et AlInN, ont leurs bandes interdites, directes, du lointain ultra-violet au proche infrarouge. Ainsi, ils sont appropriés pour de nombreuses applications dans des domaines tant civils que militaires tout en montrant de meilleures performances. De plus, l'alliage quaternaire AlGaInN montre des propriétés intéressantes car il peut être épitaxié soit avec un paramètre de maille ou une polarisation ou une bande interdite accordé au GaN. De plus, avec AlInN, ces deux alliages pourraient, à terme, remplacer les barrières conventionnelles AlGaN/GaN pour les applications aux Transistors à Haute Mobilité Électroniques (HEMT) grâce à des performances supérieures prouvées théoriquement.Dans ce travail, nous avons étudié les alliages AlInN et AlGaInN dont la croissance a été faite par épitaxie en phase vapeur d’organométalliques (MOVPE). Pour cela, la microscopie électronique en transmission a été notre principal outil de caractérisation. Le but était de caractériser les défauts et les mécanismes de croissance pendant la MOVPE. Dans cette optique, l'incorporation de gallium dans la barrière en raison de la géométrie de la chambre de croissance menant à un alliage quaternaire a été étudiée. Le contrôle du taux de gallium est réalisé soit par un processus de nettoyage entre les épitaxies soit par les conditions de croissance. Les défauts ont été ensuite différenciés comme extrinsèques et intrinsèques. En effet, les dislocations et les domaines d'inversion dans le GaN produisent des défauts extrinsèques, tandis que, les « pinholes » non connectés aux dislocations et les « hillocks » responsables de la rugosité de surface sont définis comme intrinsèques. Les origines des défauts intrinsèques dépendent fortement des propriétés physiques des composés parents binaires. Ces dégradations systématiques sont observées même lorsque les conditions de croissance sont optimisées et quand la composition du film mince est changée ou son épaisseur augmentée.Notre travail propose des mécanismes différents pour expliquer les processus de dégradation pour les différents défauts observés et constitue donc un pas en avant pour la réalisation de HEMT à base de AlInN et AlGaInN de meilleure qualité. / Group III-Nitrides and their alloys exhibit outstanding properties and are being extensively investigated since the 90’s. In comparison to other III-V semiconductors, III-nitrides (AlGaN, InGaN, and AlInN) cover from deep ultraviolet (UV) to near infrared (IR) across the visible range of wavelengths. Thus, they are suitable for numerous applications both in civilian and military fields showing higher performances. Moreover, the quaternary alloy AlGaInN shows versatile properties as it can grow either lattice or polarization or bandgap matched to GaN. Alongside to AlInN, these two alloys are expected to replace conventional AlGaN/GaN High Electron Mobility Transistors (HEMT) barriers as higher performances have been theoretically demonstrated.In this work, we have studied AlInN and AlGaInN grown by metal organic vapor phase epitaxy (MOVPE) using mainly TEM. The aim was to characterize defects and the MOVPE growth alloying process. In this instance, the gallium incorporation in the barrier due to the geometry of the growth chamber leading to a quaternary alloy was studied. The control of the gallium content is achieved by a cleaning process between runs or by the growth condition. Defects were then differentiated as extrinsic and intrinsic. In this way, dislocations and inversion domains from the GaN buffer layer generate extrinsic defects, while, pinhole not connected to dislocations and individual hillocks responsible of surface roughening are termed as intrinsic. The origins of the latter defects depend strongly on the physical mismatches of the end-binary compound. These systematic degradations happen also with optimized growth conditions as soon as the nominal composition is changed and/or the thickness is increased.Our work proposes different mechanisms to explain defects generation processes which constitutes a forward step for higher quality HEMTs.

Due to the current public demand of faster, more powerful, and more reliable electronic devices, research is prolific these days in the area of high electron mobility transistor (HEMT) devices. This is because of their usefulness in RF (radio frequency) and microwave power amplifier applications including microwave vacuum tubes, cellular and personal communications services, and widespread broadband access. Although electrical transistor research has been ongoing since its inception in 1947, the transistor itself continues to evolve and improve much in part because of the many driven researchers and scientists throughout the world who are pushing the limits of what modern electronic devices can do. The purpose of the research outlined in this paper was to better understand the mechanical stresses and strains that are present in a hybrid AlGaN (Aluminum Gallium Nitride) / GaN (Gallium Nitride) HEMT, while under electrically-active conditions. One of the main issues currently being researched in these devices is their reliability, or their consistent ability to function properly, when subjected to high-power conditions. The researchers of this mechanical study have performed a static (i.e. frequency-independent) reliability analysis using powerful multiphysics computer modeling/simulation to get a better idea of what can cause failure in these devices. Because HEMT transistors are so small (micro/nano-sized), obtaining experimental measurements of stresses and strains during the active operation of these devices is extremely challenging. Physical mechanisms that cause stress/strain in these structures include thermo-structural phenomena due to mismatch in both coefficient of thermal expansion (CTE) and mechanical stiffness between different materials, as well as stress/strain caused by "piezoelectric" effects (i.e. mechanical deformation caused by an electric field, and conversely voltage induced by mechanical stress) in the AlGaN and GaN device portions (both piezoelectric materials). This piezoelectric effect can be triggered by voltage applied to the device's gate contact and the existence of an HEMT-unique "two-dimensional electron gas" (2DEG) at the GaN-AlGaN interface. COMSOL Multiphysics computer software has been utilized to create a finite element (i.e. piece-by-piece) simulation to visualize both temperature and stress/strain distributions that can occur in the device, by coupling together (i.e. solving simultaneously) the thermal, electrical, structural, and piezoelectric effects inherent in the device. The 2DEG has been modeled not with the typically-used self-consistent quantum physics analytical equations, rather as a combined localized heat source* (thermal) and surface charge density* (electrical) boundary condition. Critical values of stress/strain and their respective locations in the device have been identified. Failure locations have been estimated based on the critical values of stress and strain, and compared with reports in literature. The knowledge of the overall stress/strain distribution has assisted in determining the likely device failure mechanisms and possible mitigation approaches. The contribution and interaction of individual stress mechanisms including piezoelectric effects and thermal expansion caused by device self-heating (i.e. fast-moving electrons causing heat) have been quantified. * Values taken from results of experimental studies in literature

No description available.