Spelling suggestions: "subject:"info:entrepo/classification/ddc/502.825"" "subject:"info:restrepo/classification/ddc/502.825""
1 |
High-Yield Wafer-Scale Self-Assembly of 3D Microelectronic Devices for Electron OpticsHuber, Renato 25 February 2025 (has links)
Parallel fabrication of 3D self-assembled micro coils has been carried out, providing the basis for micro electromagnetic elements capable of shaping and modulating an electron beam with an adjustable magnetic field. The self-assembled micro coils were fabricated in parallel using a polymer technology demonstrated on a 6-inch wafer. The parallel process also successfully integrates the Bosch's deep silicon etching process to open an aperture for the electron beam. An 88% yield was achieved in this parallel process. The individual fabricated devices were tailored to fulfil various electron optical functions, including deflectors, lenses, and phase plates. Given their small dimensions, these devices were retrofitted into an existing transmission electron microscope. A static deflection in the mrad regime was observed for 300 kV electrons. In addition, 2D deflectors for the electron beam were fabricated to allow blanking, 2D scanning and a proof of concept for stroboscopic experiments. Useful electron beam deflection was observed up to a frequency of 100 MHz. The focusing devices used magnetic quadrupole schemes and achieved focal lengths of as little as 46 mm for 300 kV electrons. In addition, phase plate devices have been developed that can shift the phase of the 300 keV electron beam in the azimuthal direction up to several 1000 π rad. These elements indicate the practicality of miniaturizing electron optical components for a variety of applications, including multibeam instruments, miniaturized electron optical instruments, stroboscopic measurement setups, and the in-situ application of a tunable magnetic field.:NOTATION AND REMARKS VI
1 MOTIVATION 1
2 THEORY AND BACKGROUND 7
2.1 MICRO ELECTROMAGNETS 8
2.1.1 Magnetic Field Generation: Biot-Savart law 9
2.1.2 Electrical Characteristics 12
2.2 ELECTRON OPTICS 18
2.2.1 Deflectors, Differential Phase Contrast, and Dipoles 18
2.2.2 Electron Vortex Beam 21
2.2.3 Quadrupole Lenses 25
3 DESIGN, FABRICATION, AND TESTING SETUP 29
3.1 DESIGN AND FABRICATION OVERVIEW 30
3.1.1 Micro Electron Optical Systems: Design 30
3.1.2 Fabrication Steps (Flowchart) 36
3.2 WAFER-SCALE FABRICATION 38
3.2.1 Photolithography 38
3.2.2 Self-Assembly: Polymer Platform 45
3.2.3 Deposition Methods: Sputtering and Atomic Layer Deposition 56
3.2.4 Bosch Process (BP) 59
3.3 SINGLE DEVICE COMPLETION AND TESTING 63
3.3.1 Wafer dicing, micro wire insertion and shaping 63
3.3.2 Device Characterization 69
3.3.3 Experiment Setup: TEM Sample Holders 71
4 RESULTS AND DISCUSSION 77
4.1 YIELD OF SELF-ASSEMBLED MICRO COILS ON 6-INCH WAFER 78
4.1.1 Electrical Characterization: Planar versus Rolled 79
4.1.2 Visual Inspection 85
4.1.3 Current Breakdown Test 90
4.2 STATIC ELECTRON OPTICS DEVICES 95
4.2.1 Phase Plate: Electron Vortex Beam Generator 95
4.2.2 Deflector: Miniaturized Dipole 100
4.2.3 Magnetic Quadrupole: Focusing 106
4.3 DYNAMIC ELECTRON OPTICS 111
4.3.1 High-Frequency Deflection 112
4.3.2 Stroboscopic Setup 116
5 SUMMARY AND OUTLOOK 121
BIBLIOGRAPHY I
APPENDICES XI
APPENDIX A XII
APPENDIX B XIV
APPENDIX C XVIII
LIST OF FIGURES AND TABLES XXI
ACKNOWLEDGEMENT XXVI
VERSICHERUNG XXVIII
|
Page generated in 0.1082 seconds