This paper presents an overview of the research work currently being performed within the frame of project DAAB and its successor DAAB-TX towards the integration of ultra-wideband transceivers operating at mm-wave frequencies and capable of data rates up to 100 Gbits–¹. Two basic systemarchitectures are being considered: integrating a broadband antenna with a distributed amplifier and integrate antennas centered at adjacent frequencies with broadband active combiners or dividers. The paper discusses in detail the design of such systems and their components, fromthe distributed amplifiers and combiners, to the broadband silicon antennas and their single-chip integration. All components are designed for fabrication in a commercially available SiGe:C BiCMOS technology. The presented results represent the state of the art in their respective areas: 170 GHz is the highest reported bandwidth for distributed amplifiers integrated in Silicon; 89 GHz is the widest reported bandwidth for integrated-system antennas; the simulated performance of the two antenna integrated receiver spans 105 GHz centered at 148GHz, which would improve the state of the art by a factor in excess of 4 even against III-V implementations, if confirmed by measurements.