NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 51 to 60 of 314 (0.036 seconds)

Spelling suggestions: "subject:"nonholders"" "subject:"polysolder""

51

System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques

Liu, Sheng 05 1900 (has links)
No description available.
Electronic packaging
Solder and soldering
Lasers in engineering
52

Finite element analysis of printed wiring board deformations during thermal cycles involved in the solder masking process

Martin, Timothy Lee 05 1900 (has links)
No description available.
Solder and soldering
Printed circuits
Finite element method
53

Fundamentals of solder interconnect wetting

Kang, Suk Chae 05 1900 (has links)
No description available.
Solder and soldering
Wettings
54

Design of an advanced system for inspection of microelectronic devices and their solder connections using laser-induced virbration techniques

Howard, Turner A. 08 1900 (has links)
No description available.
Microelectronics Testing
Solder and soldering Quality control
55

Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder

Woodmansee, Michael W. 08 1900 (has links)
No description available.
Solder and soldering
56

Flip chip processing of lead-free solders and halogen-free high density microvia substrates

Baynham, Grant Andrew 05 1900 (has links)
No description available.
Microelectronic packaging Materials
Solder and soldering
Green technology
57

Effect of Cu concentration and cooling rate on microstructure of Sn-3.9Ag-XCu

Athavale, Saurabh. January 2006 (has links)
Thesis (M.S.M.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.
58

Numerical prediction and experimental validation of flip chip solder joint geometry for MEMS applications /

Lo, Chi Chuen. January 2008 (has links)
Thesis (Ph.D.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 149-158). Also available in electronic version.
59

Application of artificial neural networks to predict defect levels in wave soldering processes

Samant, Purnanand G. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Dept. of Systems Science and Industrial Engineering, 2007. / Includes bibliographical references.
60

Experimental and numerical study of solder ball joints' reliability at package level & board level /

Xu, Zhengjian. January 2009 (has links)
Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2009. / Includes bibliographical references (leaves 99-110).

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