Because of the tremendous amount of media streaming, video calling and high definition TV and gaming, the biggest challenge for the wireless industry is the increasing demand of high data rates. Utilization of mm-wave frequencies is an attractive option to meet this high demand. Recent advances in low cost semiconductor technologies allow realization of low-cost on-chip RF front-ends in the high millimeter wave (mm-wave) frequencies, making it possible to realize compact systems for these application areas. Although integrated circuits (ICs) are one of the main building blocks of a mm-wave system, in order to realize a fully functional wireless system, cost-effective antenna design and packaging are two important pre-conditions. Researchers have investigated and reported low-cost electronics packaging up to 100 GHz to a great extent on ceramic substrates, but mm-wave packaging above 100 GHz is relatively less explored, particularly on organic substrates. This Ph.D. dissertation demonstrates the design and development of microwave and mm-wave on-chip and on-package antennas and organically packaged components and modules ranging from 20 GHz to 170 GHz. The focus of this research was to design and develop mm-wave components and modules on LCP, to investigate the viability of this organic substrate and development of fabrication techniques in the K- (18-26.5 GHz), V- (50 to 70 GHz), W- (75 to 110 GHz), and D- (110 to 170 GHz) bands. Additionally, a demonstration of a micro-machined on-chip antenna has also been presented. This dissertation is divided in three parts: (1) characterization of liquid crystal polymer from 110 to 170 GHz. (2) development of highly radiation efficient on-chip and AiP antennas, and (3) development of mm-wave modules with the integration of antennas.

Yes / This paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 μm. The aluminium ground-plane with thickness of 3 μm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances CL that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors LL, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350–0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm3 that makes it suitable for on-chip implementation. / This work is partially supported by RTI2018-095499-B-C31, Funded by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER,UE), and innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the fnancial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. / Research Development Fund Publication Prize Award winner, March 2020