Spelling suggestions: "subject:"packaging interconnect"" "subject:"packaging interconnected""
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Design and fabrication of free-standing structures as off-chip interconnects for microsystems packagingKacker, Karan. January 2008 (has links)
Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Dr. Suresh K. Sitaraman; Committee Member: Dr. F. Levent Degertekin; Committee Member: Dr. Ioannis Papapolymerou; Committee Member: Dr. Madhavan Swaminathan; Committee Member: Dr. Nazanin Bassiri-Gharb. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approachMehrotra, Gaurav. January 2008 (has links)
Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Raj.
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Modeling of simultaneous switching noise in on-chip and package power distribution networks using conformal mapping, finite difference time domain and cavity resonator methodsMao, Jifeng. January 2004 (has links)
Thesis (Ph. D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2005. / Madhavan Swaminathan, Committee Chair ; Sung Kyu Lim, Committee Member ; Abhijit Chatterjee, Committee Member ; David C. Keezer, Committee Member ; C. P. Wong, Committee Member. Vita. Includes bibliographical references.
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