Thin films provide a remarkable asset, as depositing a thin surface layer can completely alter a material’s characteristics and provide new, inexpensive, and valuable properties. In 2020, a new Chemical Vapour Deposition (CVD) approach was developed at Linköping University, using plasma electrons as reducing agents for the deposition of metallic thin films. To understand the CVD approach, comprehension of the deposition chemistry is crucial. In this thesis, I have performed a theoretical examination of the gas phase and surface chemistry of ferrocene in the recently developed CVD method to form metallic iron thin films, using plasma electrons as reducing agents. Results show that ferrocene anion formation and dissociation are probable in the gas phase, depending on the energy of the plasma electrons. It gets successively easier to dissociate the complex after gaining electrons. The most probable gas phase species leading to film formation was determined as FeCp2-, FeCp, and Cp− under the normal deposition parameters. An electron energy above 220 kJ/mol would suffice for ion formation and dissociation to form FeCp and Cp− fragments. On the surface, ferrocene’s vertical and horizontal adsorption is equally probable, with energies around -72 kJ/mol. Cp, Fe, and FeCp with Fe facing towards the surface interacts stronger with the surface than ferrocene, with adsorption energies of -179, -279 kJ/mol, and -284 kJ/mol. FeCp with Fe facing up from the surface had adsorption energy of -23 kJ/mol. As the surface bonding of Fe and FeCp with Fe facing the surface is stronger than for the other species, this poses a possible way of tuning the CVD method to limit carbon impurities. By providing above 180 kJ/mol energy, for example in the form of heating the substrate, the unwanted species FeCp2, Cp, and FeCp with the ring facing downwards would desorb from the surface, leaving the Fe and FeCp fragments with iron facing towards the surface still adsorbed. This poses a possible way of reducing carbon impurities.