The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.

The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.

Bc. COVRIGHIN Sergiu. Bulk forming technology of cases. Diploma thesis in fifth class of master studies, academic year 2009/2010, study group 5M/68, FME UT in Brno, Institute of Manufacturing Technology, Department of Metal Forming, May 2010, pages 46 , 18 fig., 7 tab., 4 annexes. In diploma thesis is introduced a technological proposal regarding production of cases by bulk forming from cemented steel 14 220.3. Despite the estimated number of parts which is 70000 a year, quality and product accuracy, 2 options of technological procedures concerning cold bulk forming wth combination of backward and forward extrusion are being considered. For chosen option are elaborated technological calculations. As for the suggested technology, crank press, force 8000 kN and made by company KRUPP was chosen. Material for extruder is steel 19 569 and material for extrusion die is steel 19 655.

TŘEŠTÍK Jakub: Metal forming production of spring bush by cold extrusion. The Master’s degrese project, 2nd form, summer semester, academic year 2009/2010, educational group 5O/60, Mechanical Engineering – Manufacturing Technology, Brno University of Technology, Fakulty of Mechanical Engineering, Institute of Manufacturing Technology, Dept. Of Metal Forming and Plastic, May 2010. This project sloves the manufacturing proces sof “Spring bush” part by technology of cold extrusion. Part is made of 12 122.3 steel. Semifinished product has a cylinder shape with dimensions O29-24 mm. This part is made during four bulk forming operations on the TPZK 25 Šmeral Brno, a.s.

The goal of this thesis is to work out an introduction to the chip packaging and decapsulation. Further can be found a description of a method leading to dacapsulate concrete chips. Final part is devoted to getting chip pictures using microscope and analysis of the pictures afterwards.

The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.

The work deals with research and development of a new method for ball-attach process, resp. reballing process of solder bumps on package with solder ball terminals (BGA, CSP, SOP, etc.), based on research and optimization of the parameters of the final terminals. The output is specially modified templates designed for placement of solder balls before reflow soldering. Three materially different templates were investigated in the work, in addition to the commonly used stainless steel, two other newly designed templates, which used ceramic materials (96% Al2O3a AlN) with thick-layer resistance heating. Proven advantages of the method using templates directly heated by electric current are the reduction of the thermal load of BGA packages in the first soldering process, as well as the creation of a better connection between the metallization of the case and the solder ball after final soldering to the printed circuit board. During the research, development and optimization of the method, tests of the created solder bumps were performed from the point of view of mechanical strength and internal structure. In the next part of the work, a research of solder bumps soldered using infrared heaters was performed in order to determine the influence of the heat flow direction in the process of reflow soldering. The heaters were successively placed in three positions, i.e. heating from the bottom of the housing, heating from the top and both heaters simultaneously. After sample preparation, metallographic cuttings and etching, the analysis of the internal structure of the entire solder ball and the intermetallic layer at the interface of the solder and the solder pad was performed. The work represents not only a new method of soldering solder bumps, but also new knowledge to create their internal structure, which contributes to meeting the increasingly demanding requirements to achieve the required reliability and quality.

This thesis mainly deals with the prediction of temperature on the components and the PCB during reflow soldering. The theoretical part describes the particular solder reflow process, types of heat transfer and temperature profiles. The practical part is divided into forecasting temperatures if the conveyor is stopped and the temperature predictions when the conveyor is in motion. In both parts of the measured temperature is compared with the predicted temperatures, which show the success rate of prediction. The last part of this work is part of the simulation, which helps in proper understanding of the issues discussed.

This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.

The goal of this diploma thesis is to design the journal bearings for high pressure diesel pump which is part of Common rail system from Motorpal Company. This producer is also submitter of this diploma thesis and as a result it is expecting the reduction of cost price and possible transfer to the diesel oil lubrication. Firstly, there is sum up of issues of high pressure pump by Motorpal. The next part of the thesis describes the journal bearings and its construction, tribology of the journal bearings and also the overview of the materials. These materials are currently being used for securing long time usage and do not require service maintenance during lifespan period. In the practical part there is applied the Multy Body System (MBS) approach with rigid bodies and after that there are used analytic relations, which however do not include impact of movement of the journal center during dynamic stress. The thesis concludes with a comparison of results of both calculations and determination of bearing parameters, which according to the calculations ensure an achievement of hydrodynamic lubrication.