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Characteristics of a New Trench Oxide Layer Polysilicon Thin-Film Transistor and its 1T-DRAM ApplicationsChiu, Hsien-Nan 29 July 2010 (has links)
In this thesis, we propose a simple trench oxide layer polysilicon thin-film Transistor (TO TFT) process and the self-heating effects can be significantly reduced because of its structural advantages. According to the ISE-TCAD simulation results, our proposed TO TFT structure has novel features as follows: 1. The buried oxide and the isolation oxide are carried out simultaneously in order to achieve a goal of simple process. 2. The trench design is used to improve both the sensing current windows (~ 84%) and the retention time (~ 57%). 3. The thermal stability is drastically improved by its naturally formed source/drain tie. The above mentioned features help our proposed device structure to demonstrate the desired characteristics that are better than that of a conventional TFT. Additionally, the thermal instability is drastically improved which is good for long-term device operation.
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