碩士 / 國立交通大學 / 電子研究所 / 98 / The flip-chip package which was developed by IBM in the 60's provides a high chip-density solution to the demand of more I/O buffers in VLSI designs. The RDL routing problem is connected between chip domain and package domain, which means that the result of the RDL routing problem has strong influences on the chip performance and the package performance. Therefore, the concept of chip-package-board codesign is proposed and it is become more popular in recent years. In this thesis, we propose a routing algorithm for area-I/O RDL routing problem. Our algorithm contains chip-level assignment and RDL-level routing. In both chip-level assignment and RDL-level routing, we take not only wirelength but also signal influence into account. Experimental results have shown that our algorithm can improve bump assignment significantly with reasonable extra wirelength and it can achieve 100\% RDL routability.
| Identifer | oai:union.ndltd.org:TW/098NCTU5428093 |
| Date | January 2010 |
| Creators | 林昆生 |
| Contributors | Chen, Hung-Ming, 陳宏明 |
| Source Sets | National Digital Library of Theses and Dissertations in Taiwan |
| Language | en_US |
| Detected Language | English |
| Type | 學位論文 ; thesis |
| Format | 33 |
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