No / The transient liquid phase (TLP) bonding of Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles. Bond formation was attributed to two mechanisms; first, solid-state diffusion of Ni and Mg, followed by liquid eutectic formation at the Mg-AZ31 interface. Second, the solid-state diffusion of Ni and Ti at the Ti-6Al-4V interface resulted in a metallurgical joint. The joint interface was characterized by scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction analysis. Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds. The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa. This shear strength value corresponded to a 15 % enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion. / The authors would like to acknowledge The German Jordanian University (GJU), and NSERC Canada for the financial support for this research.
| Identifer | oai:union.ndltd.org:BRADFORD/oai:bradscholars.brad.ac.uk:10454/11603 |
| Date | 30 July 2014 |
| Creators | Atieh, A.M., Khan, Tahir I. |
| Source Sets | Bradford Scholars |
| Language | English |
| Detected Language | English |
| Type | Article, No full-text in the repository |
| Rights | © Springer Science+Business Media New York 2014. The final publication is available at Springer via http://dx.doi.org/10.1007/s10853-014-8473-z |
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