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Experimental studies on particle damping technology for electronics manufacturing equipment.

Chan Kwong-wah. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. / Includes bibliographical references (leaves 85-87). / Abstracts in English and Chinese. / LIST OF FIGURES --- p.vii / LIST OF TABLES --- p.xi / Chapter 1 --- INTRODUCTION --- p.1 / Chapter 1.1 --- Background --- p.1 / Chapter 1.1.1 --- Vibration Control --- p.1 / Chapter 1.1.2 --- Passive Damping and Particle Damping Technology --- p.2 / Chapter 1.2 --- Literature Review --- p.4 / Chapter 1.3 --- Research Objective --- p.7 / Chapter 1.4 --- Organization of the Thesis --- p.7 / Chapter 2 --- PARTICLE DAMPING CHARACTERISTICS AND FEASIBILITY --- p.9 / Chapter 2.1 --- Particle Damping Characteristics --- p.9 / Chapter 2.1.1 --- Energy Balance in SDOF System --- p.9 / Chapter 2.1.2 --- Energy Dissipation Mechanisms in Particle Damping --- p.10 / Chapter 2.2 --- Particle Damping Feasibility --- p.15 / Chapter 2.2.1 --- Cantilever Beam Experiment with Free Vibration --- p.15 / Chapter 2.2.2 --- Effectiveness of Particle Damping --- p.17 / Chapter 3 --- A STUDY ON PACKING RATIO AND GRANULE SIZE --- p.19 / Chapter 3.1 --- Experimental Setup --- p.19 / Chapter 3.2 --- Effect of Packing Ratio --- p.23 / Chapter 3.3 --- Effect of Granule Size --- p.24 / Chapter 3.4 --- Damping Ratio Estimation --- p.25 / Chapter 3.5 --- Trends of Damping Ratio against Packing Ratio --- p.28 / Chapter 3.6 --- Trends of Damping Ratio against Granule Size --- p.32 / Chapter 3.7 --- Conclusions --- p.35 / Chapter 4 --- APPLICATION OF PARTICLE DAMPING ON BOND ARM --- p.36 / Chapter 4.1 --- Identification of Structural Vibration --- p.37 / Chapter 4.2 --- Finite Element Modeling --- p.39 / Chapter 4.2.1 --- Model of Bond Arm --- p.39 / Chapter 4.2.2 --- Material Properties --- p.40 / Chapter 4.2.3 --- Modes of Frequencies --- p.40 / Chapter 4.2.4 --- Mode Shapes of Bond Arm --- p.41 / Chapter 4.3 --- Experimental Setup and Procedure --- p.41 / Chapter 4.4 --- Design of Particle Enclosure --- p.43 / Chapter 4.5 --- System Parametric Study --- p.44 / Chapter 4.5.1 --- Effect of Granule Sizes --- p.44 / Chapter 4.5.2 --- Effect of Packing Ratios --- p.47 / Chapter 4.5.3 --- Effect of Different Materials of Particle Enclosure --- p.50 / Chapter 4.5.4 --- Effect of Structural Form of Enclosure --- p.52 / Chapter 4.5.5 --- Effect of Number of Chambers Filled --- p.53 / Chapter 4.5.6 --- Effect of Different Locations of Particle Enclosure --- p.55 / Chapter 4.6 --- Conclusions --- p.56 / Chapter 5 --- TEST AND ANALYSIS OF BOND HEAD STAND WITH PARTICLE DAMPING --- p.57 / Chapter 5.1 --- Ways of Implementation --- p.58 / Chapter 5.1.1 --- Factor of Mode Shape --- p.59 / Chapter 5.1.2 --- Stress Concentration Analysis --- p.59 / Chapter 5.2 --- Experimental Setup --- p.60 / Chapter 5.3 --- Bond Head Stand with Small Force Excitation --- p.62 / Chapter 5.3.1 --- Measurement Data --- p.62 / Chapter 5.4 --- Bond Head Stand with Large Force Excitation --- p.70 / Chapter 5.5 --- Effect of Packing Ratio at Different Frequency Ranges --- p.71 / Chapter 5.6 --- Discussions --- p.80 / Chapter 6 --- CONCLUSION --- p.82 / Chapter 6.1 --- Summary --- p.82 / Chapter 6.2 --- Future Work --- p.84 / BIBLIOGRAPHY --- p.85 / APPENDIX

Identiferoai:union.ndltd.org:cuhk.edu.hk/oai:cuhk-dr:cuhk_323801
Date January 2002
ContributorsChan, Kwong-wah., Chinese University of Hong Kong Graduate School. Division of Automation and Computer-Aided Engineering.
Source SetsThe Chinese University of Hong Kong
LanguageEnglish, Chinese
Detected LanguageEnglish
TypeText, bibliography
Formatprint, xii, 87 leaves : ill. (some col.) ; 30 cm.
RightsUse of this resource is governed by the terms and conditions of the Creative Commons “Attribution-NonCommercial-NoDerivatives 4.0 International” License (http://creativecommons.org/licenses/by-nc-nd/4.0/)

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