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Thermomechanical stress analysis of flip chip packages

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/16002
Date08 1900
CreatorsLe Gall, Carole A.
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Detected LanguageEnglish
TypeThesis
RightsAccess restricted to authorized Georgia Tech users only.

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