Nowadays numerical simulations are used to optimize manufacturing process. These numerical simulations need a large amount of input parameters and some of these parameters have not been sufficiently described. One of this parameter is thermal contact resistance, which is not sufficiently described for high temperatures and high contact pressure. This work describes experimental measuring of thermal contact resistance and how to determine thermal contact conductance which can be used as a boundary condition for numerical simulations. An Experimental device was built in Heat Transfer and Fluid Flow Laboratory, part of Brno University of Technology, and can be used for measuring thermal contact conductance in various conditions, such as contact pressure, initial temperatures of bodies in contact, type of material, surface roughness, presence of scales on the contact surface. Bodies in contact are marked as a sensor and a sample, both are embedded with thermocouples. The temperature history of bodies during an experiment is measured by thermocouples and then used to estimate time dependent values of thermal contact conductance by an inverse heat conduction calculation. Results are summarized and the dependence of thermal contact conductance in various conditions is described.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:255771 |
| Date | January 2016 |
| Creators | Kvapil, Jiří |
| Contributors | Návrat, Tomáš, Brestovič, Tomáš, Horský, Jaroslav |
| Publisher | Vysoké učení technické v Brně. Fakulta strojního inženýrství |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/doctoralThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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