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Analysis and modeling of discontinuities and inter-element coupling in passive microwave integrated circuit components

Accurate, efficient and general computational
techniques are developed to evaluate the scattering
parameters of passive microstrip components composed of
discontinuities in microstrip transmission lines on
general two layer substrates with single and two level
metallization. An open domain model is used. The
Electric Field Integral Equation is examined and the
Green's function for single and double layer dielectric
substrates on a infinite ground plane are reviewed while
emphasizing the important computational details to the
model, including singularity of the kernel, evaluation of
the Sommerfeld Integrals, and interpolation of the Green's
functions. In order to model accurately complex circuit
geometries, two dimensional currents are used. Different
basis functions for expansion and for testing are chosen
in order to make the computation more efficient and allow
for structures having general shape in the moment method
formulation. A transmission line current source is used
to model the parameters are flowing in and circuit evaluated
out of structure. Structures excitation and the scattering
by calculating the currents each of the N-ports of the
such as microstrip bends, microstrip crossovers of arbitrary angle, and coupled
microstrip discontinuities are analyzed. To validate the
model, results of some elementary structures are compared
with published results of other models. / Graduation date: 1992

Identiferoai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/36257
Date02 April 1991
CreatorsThorburn, Michael Arthur
ContributorsTripathi, Vijai K.
Source SetsOregon State University
Languageen_US
Detected LanguageEnglish
TypeThesis/Dissertation

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