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Modelování technologických kroků kontaktování čipu mikrodrátkem / Modeling of wirebonding technological steps for chip connection

This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:220082
Date January 2013
CreatorsHouserek, Jiří
ContributorsKosina, Petr, Psota, Boleslav
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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