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Moderní pouzdření a 3D systémy / Advancing Packiging and 3D systems

This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217904
Date January 2009
CreatorsNicák, Michal
ContributorsŠandera, Josef, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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