The magnetron sputtering process has become established as the process of choice for the deposition of a wide range of industrially important coatings. However, despite its successes, there are inherent limitations in the current process. The ion-to-atom ratio incident at the substrate, which has a profound effect on coating properties, cannot readily be varied using present technology. Consequently, film properties may not be optimal. The relation between the incident charge and the energy delivered to the surface is another parameter that cannot be controlled in classical magnetron sputtering systems. This in turn can lead to difficulties in controlling the reaction between reactive gases and deposited materials, controlling the surface status prior, during and after deposition, monitoring the natural growth of native oxides and their combined effect on the adhesion of the thin film and the optical and electrical properties of the coated surface.
| Identifer | oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:490427 |
| Date | January 2007 |
| Creators | Yahia, Maymon |
| Publisher | University of Salford |
| Source Sets | Ethos UK |
| Detected Language | English |
| Type | Electronic Thesis or Dissertation |
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