Return to search

Roughening of electrodeposited copper films: mass transport and additive effects

The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure.

Identiferoai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:492459
Date January 2008
CreatorsWood, Matthew Aaron Saunders
PublisherUniversity of Bristol
Source SetsEthos UK
Detected LanguageEnglish
TypeElectronic Thesis or Dissertation

Page generated in 0.002 seconds