The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure.
Identifer | oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:492459 |
Date | January 2008 |
Creators | Wood, Matthew Aaron Saunders |
Publisher | University of Bristol |
Source Sets | Ethos UK |
Detected Language | English |
Type | Electronic Thesis or Dissertation |
Page generated in 0.002 seconds