Due to pending legislations and market pressure, lead-free solders will replace Sn–Pb solders in 2006. Among the lead-free solders being studied, eutectic Sn–Ag, Sn–Cu and Sn–Ag–Cu are promising candidates and Sn–3.8Ag–0.7Cu could be the most appropriate replacement due to its overall balance of properties. In order to garner more understanding of lead-free solders and their application in flip-chip scale packages, the properties of lead free solders, including the wettability, intermetallic compound (IMC) growth and distribution, mechanical properties, reliability and corrosion resistance, were studied and are presented in this thesis.
| Identifer | oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:420152 |
| Date | January 2005 |
| Creators | Li, Dezhi |
| Publisher | Loughborough University |
| Source Sets | Ethos UK |
| Detected Language | English |
| Type | Electronic Thesis or Dissertation |
| Source | https://dspace.lboro.ac.uk/2134/34206 |
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