The widely growing market of miniaturized electronic devices demands for alternative substrate materials and manufacturing technologies on which fine pitch components can be mounted. Glass has been identified as a potential substrate material as it offers a number of advantages including a coefficient of thermal expansion closely matched to that of silicon that may reduce the thermo-mechanical stresses on the interconnects in the flip-chip assemblies. In addition to this, its dimensional stability and optically transparent nature facilitates alignment of multiple layer structures, enabling accurate drilling of microvias to capture pads and the potential for applications in optical interconnect.
| Identifer | oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:519608 |
| Date | January 2009 |
| Creators | Bhatt, Deepa M. |
| Publisher | Loughborough University |
| Source Sets | Ethos UK |
| Detected Language | English |
| Type | Electronic Thesis or Dissertation |
| Source | https://dspace.lboro.ac.uk/2134/28103 |
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