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Finite Element Analysis on MLCC BME Processes

The mechanical and electrical properties of thin films have been become important and urgent in recent years, especially, the laminated structure made by films stacked over hundreds of layers. For example, the Multi-Layered Ceramic Capacitors (MLCCs) are such structures fabricated by one layer ceramic film interleaves with one layer electrode film repeatedly a hundred times. Thus, the advantages of MLCCs include small volume, mass product, and high capacity. That makes the MLCCs the necessary part of passive components.
The Finite element method is adopted in the study. The model is built by the simulation program of ANSYS. After meshing and setting boundary conditions, the numerical process is performed.
The numerical simulation was started first by applying a uniformly distributed pressure on the top of near hundred layers of MLCCs before sintering process with the bottom plate fixed. Then, the displacement and stress fields of MLCCs under five pressures were obtained and discussed. In order to visualize the results, the data of displacement and the stress fields were listed in Tables and plot in Figures.
In addition to the MLCCs under vertically and uniformly distributed pressure, the slightly slant distributed pressure and gradient distributed pressure had been simulated. Next, the results of changing Young¡¦s modulus had also been received. It is found that the vertical distributed pressure and slant distributed pressure were not the main factor led to the side deformation. The lateral constraint of gradient distributed pressure would influence the deformation of the MLCCs significantly.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0725109-152041
Date25 July 2009
CreatorsHuang, Tsun-yu
ContributorsLIU CHUNG FU, JEN MING HUA, WU HSUEH CHIEN, KUNG HUANG KUANG
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0725109-152041
Rightsnot_available, Copyright information available at source archive

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