A process with aim to prepare an oxidically and thermal resistant layer was performed on the samples from clear aluminium (99,99+ %, VÚK čisté kovy, s. r. o.) and on the samples from clear titanium (99,95 % Goodfellow) with a layer from sputtered aluminium (99,99 %, VÚK čisté kovy, s. r. o.), An oxidic layer was prepared on the samples by anodization in the oxalic acid. The layer had fine, hexagonally organized pores with the diameter of 30 nm. During the following processing was the structure prepared for the electrochemical deposition of copper to the pores. The aim of the electrodeposition was preparation of copper nanowires deposited into the pores of the oxidic layer. The process was performed in the solution of copper sulfate and sulfuric acid in water. The controlling parameter of the deposition was voltage which had a very asymmetric period. The period had to be optimized for a successful preparation of the wires. The result of the whole process was structure with oxidic matrix whose most of the pores were filled with copper.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:254367 |
| Date | January 2016 |
| Creators | Šťastná, Eva |
| Contributors | Pouchlý, Václav, Jan, Vít |
| Publisher | Vysoké učení technické v Brně. Fakulta strojního inženýrství |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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