<p>BIHARI, KATHLEEN LOUISE. Analysis of Thermal Conductivity in Composite Adhesives (Under the direction of H. Thomas Banks). Thermally conductive composite adhesives are desirable in many industrial applications, including computers, microelectronics, machinery and appliances. These composite adhesives are formed when a filler particle of high conductivity is added to a base adhesive. Typically, adhesives are poor thermal conductors. Experimentally only small improvements in the thermal properties of the composite adhesives over the base adhesives have been observed. A thorough understanding of heat transfer through a composite adhesive would aid in the design of a thermally conductive composite adhesive that has the desired thermal properties.In this work, we study design methodologies for thermally conductive composite adhesives. We present a three dimensional model for heat transfer through a composite adhesive based on its composition and on the experimental method for measuring its thermal properties. For proof of concept, we reduce our model to a two dimensional model. We present numerical solutions to our two dimensional model based on a composite silicone and investigate the effect of the particle geometry on the heat flow through this composite. We also present homogenization theory as a tool for computing the ``effective thermal conductivity" of a composite material.We prove existence, uniqueness and continuous dependence theorems for our two dimensional model. We formulate a parameter estimation problem for the two dimensional model and present numerical results. We first estimate the thermal conductivity parameters as constants, and then use a probability based approach to estimate the parameters as realizations of random variables. A theoretical framework for the probability based approach is outlined.Based on the results of the parameter estimation problem, we are led to formally derive sensitivity equations for our system. We investigate the sensitivity of our composite silicone with respect to the thermal conductivity of both the base silicone polymer and the filler particles. Numerical results of this investigation are also presented. <P>
| Identifer | oai:union.ndltd.org:NCSU/oai:NCSU:etd-20010808-130536 |
| Date | 08 August 2001 |
| Creators | Bihari, Kathleen L. |
| Contributors | H. T. Banks, K. Ito, H. T. Tran, J.-P. Fouque |
| Publisher | NCSU |
| Source Sets | North Carolina State University |
| Language | English |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://www.lib.ncsu.edu/theses/available/etd-20010808-130536 |
| Rights | unrestricted, I hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dissertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to NC State University or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report. |
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