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Influence of different additives on the copper electroplating onto Au(111) and Cu(111) substrates

Ulm, Univ. Diss., 2006.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/315388518
Date January 2007
CreatorsTäubert, Corina Eleonora,
Publisher[S.l. : s.n.],
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeOnline-Publikation.
SourceKostenfrei

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