Effect of bonding pressure on reliability of anisotropic conductive adhesives [sic] joints in a silicon-to-flex-substrate interconnction

Description

Thesis (M.S.E.E.)--State University of New York at Binghamton, Watson School of Engineering and Applied Science, 2006. / Includes bibliographical references.

Links & Downloads

1. http://referenc.lib.binghamton.edu:2048/login?url= http://wwwlib.umi.com/dissertations/fullcit/1435439

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/316229418
Date	January 2006
Creators	Puthenparambil, Abhilash.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: