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Anodické pájení sendvičových struktur / Anodic bonding of sandwich structures

This master thesis deals with the technology anodic soldering. It focuses mainly on soldering sandwich glass-silicon structures. Describes the soldering method and highlights its advantages. Theoretically discusses the different methods used soldering these structures and assess their possible benefits. This work explores practical ways possible soldering methods on a particular device. These different soldering methods evaluated on the basis of achieved quality connections. This thesis examines the anodic soldering at low temperatures, while there are demands on the shortening of the technological process.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:220223
Date January 2013
CreatorsUrbánek, Petr
ContributorsKosina, Petr, Pekárek, Jan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

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