This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:220082 |
| Date | January 2013 |
| Creators | Houserek, Jiří |
| Contributors | Kosina, Petr, Psota, Boleslav |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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