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Electrochemical Deposition of Bismuth Telluride and Antimony Telluride Thin Films for Micro TE-cooler Applications

¡@¡@¡@¡@¡@¡@¡@¡@¡@¡@¡@¡@¡@Abstract
This paper presents an integrated batch-produced (Bi, Sb)2Te3 micro thermoelectric cooler(£g-TEC) fabricated by electrochemical MEMS technology. To optimize the thermal conductivity of (Bi, Sb)2Te3 thin layers, a cathode with tunable rotary speed has been designed in the electroplating system to well control the thin film deposition rate and uniformity.The column-type micro thermoelectric thin films fabricated using electrochemical-deposited and patterned using photolithography processes. The thermoelectric thin films made of N-type Bi2Te3 and P-type Sb2Te3 with an average thickness of 5£gm, are connected using Cr/Au layers at the hot junctions and cold junctions. The measured Seebeck coefficient and electrical resistivity of the thermoelectric thin films,are -52£gV/K and 2.52¡Ñ10-5£[m(N-type, power factor of 0.11mW/K2m),and 71£gV/K and 1.91¡Ñ10-5£[m( P-type, power factor of 0.26mW/K2m) after annealing at 250¢J.Under the circumstances that voltage of 2-5 volts is driven, the upper and lower levels electrode shows tentatively that there is 0.7¢Jof difference in temperature.

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0713106-173707
Date13 July 2006
CreatorsLi, Ming-chan
ContributorsRuey-Shing Huang, I-Yu Huang, Shiang-Hwua Yu, Jin-Chern Chiou, Lieh-hsi Lo
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0713106-173707
Rightscampus_withheld, Copyright information available at source archive

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