The temperature fields and resulting stress fields have been calculated for a growing GaAs crystal produced by the LEC process. The calculations are based in a finite element numerical thermoelastic stress analysis. The calculated temperature fields have been compared to reported experimental measurements with good agreement. The stress fields have been used to calculate the resolved shear stresses, in the growing crystal, from which the dislocation density and distribution were determined.
Using the model the effects of a range of growth and environmental parameters on the dislocation density and distribution were determined. Theses parameters include crystal length, crystal diameter, cone taper, boron oxide thickness, gas pressure, solid/liquid interface shape, vertical temperature gradients and others. The results show that the temperature distribution in the gas surrounding the crystal, and the boron oxide thickness, were critical factors in determining the dislocation density and distribution in the crystal. The crystal radius, crystal length and interface curvature also strongly influenced the dislocation configuration. After crystal growth, the dislocation density at the end of the crystal was strongly influenced by the cooling procedure adopted. The dislocation distribution on cross-sections of the crystal exhibited two-fold, four-fold and eight-fold symmetry depending on growth and cooling conditions and position in the crystal. / Applied Science, Faculty of / Mining Engineering, Keevil Institute of / Graduate
| Identifer | oai:union.ndltd.org:UBC/oai:circle.library.ubc.ca:2429/27525 |
| Date | January 1986 |
| Creators | Schvezov, Carlos Enrique |
| Publisher | University of British Columbia |
| Source Sets | University of British Columbia |
| Language | English |
| Detected Language | English |
| Type | Text, Thesis/Dissertation |
| Rights | For non-commercial purposes only, such as research, private study and education. Additional conditions apply, see Terms of Use https://open.library.ubc.ca/terms_of_use. |
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