This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on planar polymeric optical multimode waveguides with integrated out-of-plane coupling optics and optical transceiver subassemblies based on glass interposer. Integration of polymeric waveguides on flexible substrates will be shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electrooptical printed circuit board (EOPCB). Realized on-board waveguides feature low insertion loss (minimum attenuation coefficient of below 0.1 dB/cm). For short planar waveguides (Lwaveguide = 9 cm) error free transmission (BER < 10-12) up to 30 Gbit/s was achieved. The development of glass interposer passive optical coupling structures for VCSEL-based short-distance links will be described.
| Identifer | oai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:35150 |
| Date | 09 September 2019 |
| Creators | Nieweglowski, Krzysztof, Tiedje, Tobias, Schöniger, David, Henker, Ronny, Ellinger, Frank, Bock, Karlheinz |
| Publisher | SPIE |
| Source Sets | Hochschulschriftenserver (HSSS) der SLUB Dresden |
| Language | English |
| Detected Language | English |
| Type | info:eu-repo/semantics/publishedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text |
| Rights | info:eu-repo/semantics/openAccess |
| Relation | 10.1117/12.2271046 |
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