Return to search

Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce / Interconnection Technologies for 3D Electronic and Microelectronic Constructions

The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:256547
Date January 2016
CreatorsNicák, Michal
ContributorsPietriková,, Alena, Starý, Jiří, Šandera, Josef
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/doctoralThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0018 seconds